Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488883 | Semiconductor device package having thermally conductive layers for heat dissipation | Yazhou Zhang, Jiandi Du, Hope Chiu, Cong Zhang, Fen Yu +2 more | 2022-11-01 |
| 10304816 | Semiconductor device including stacked die with continuous integral via holes | Shiv Shankar Kumar, Chin-Tien Chiu | 2019-05-28 |