Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11901260 | Thermoelectric semiconductor device and method of making same | Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Chin-Tien Chiu | 2024-02-13 |
| 11444001 | Thermoelectric semiconductor device and method of making same | Jiandi Du, Yazhou Zhang, Binbin Zheng, Sundarraj Chandran, Chin-Tien Chiu | 2022-09-13 |
| 9105647 | Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material | Junwei Hu, JaeHak Yee, Lin Tan, YuFeng Feng | 2015-08-11 |