Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105647 | Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material | Junwei Hu, JaeHak Yee, Lin Tan, Wenbin Qu | 2015-08-11 |