Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11984915 | Temperature compensation circuit and phased array apparatus | Rong Peng | 2024-05-14 |
| 9105647 | Method of forming perforated opening in bottom substrate of flipchip pop assembly to reduce bleeding of underfill material | JaeHak Yee, Lin Tan, Wenbin Qu, YuFeng Feng | 2015-08-11 |