Issued Patents All Time
Showing 51–75 of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6828173 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Larry D. Kinsman | 2004-12-07 |
| 6825547 | Semiconductor device including edge bond pads | Warren M. Farnworth, Larry D. Kinsman | 2004-11-30 |
| 6818460 | Method for applying adhesives to a lead frame | Syed Sajid Ahmad, Gregory M. Chapman, Tongbi Jiang | 2004-11-16 |
| 6803656 | Semiconductor device including combed bond pad opening | Warren M. Farnworth, Larry D. Kinsman | 2004-10-12 |
| 6800505 | Semiconductor device including edge bond pads and related methods | Warren M. Farnworth, Larry D. Kinsman | 2004-10-05 |
| 6788547 | Method of making electrical contact device | — | 2004-09-07 |
| 6781839 | Vertical surface mount apparatus with thermal carrier and method | Larry D. Kinsman, Jerry M. Brooks | 2004-08-24 |
| 6777261 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Larry D. Kinsman | 2004-08-17 |
| 6773955 | Low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2004-08-10 |
| 6765803 | Semiconductor device socket | Warren M. Farnworth, Larry D. Kinsman | 2004-07-20 |
| 6760224 | Heat sink with alignment and retaining features | David J. Corisis, Larry D. Kinsman, Leonard E. Mess | 2004-07-06 |
| 6740545 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, J. Mike Brooks | 2004-05-25 |
| 6738263 | Stackable ball grid array package | David J. Corisis, Jerry M. Brooks | 2004-05-18 |
| 6734529 | Vertically mountable interposer and assembly | Larry D. Kinsman, Warren M. Farnworth | 2004-05-11 |
| 6709893 | Interconnections for a semiconductor device and method for forming same | Larry D. Kinsman, Warren M. Farnworth | 2004-03-23 |
| 6706559 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Syed Sajid Ahmad | 2004-03-16 |
| 6686655 | Low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2004-02-03 |
| 6684493 | Vertically mountable interposer, assembly and method | Larry D. Kinsman, Warren M. Farnworth | 2004-02-03 |
| 6681480 | Method and apparatus for installing a circuit device | Larry D. Kinsman, Mike Brooks, Warren M. Farnworth, Terry R. Lee | 2004-01-27 |
| 6670550 | Underfill coating for LOC package | — | 2003-12-30 |
| 6670702 | Stackable ball grid array package | David J. Corisis, Jerry M. Brooks | 2003-12-30 |
| 6667556 | Flip chip adaptor package for bare die | — | 2003-12-23 |
| 6650007 | Stackable ceramic fbga for high thermal applications | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2003-11-18 |
| 6637103 | Method of tape bonding | — | 2003-10-28 |
| 6634098 | Methods for assembling, modifying and manufacturing a vertical surface mount package | Larry D. Kinsman, Warren M. Farnworth | 2003-10-21 |