Issued Patents All Time
Showing 26–50 of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7279797 | Module assembly and method for stacked BGA packages | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2007-10-09 |
| 7233064 | Semiconductor BGA package having a segmented voltage plane and method of making | Michael W. Morrison, Corey Jacobsen | 2007-06-19 |
| 7227261 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2007-06-05 |
| 7215015 | Imaging system | — | 2007-05-08 |
| 7200022 | Apparatus and method for mounting microelectronic devices on a mirrored board assembly | Chris G. Martin, Brent Keeth, Brian Johnson | 2007-04-03 |
| 7161821 | Apparatus and method for mounting microelectronic devices on a mirrored board assembly | Chris G. Martin, Brent Keeth, Brian Johnson | 2007-01-09 |
| 7105380 | Method of temporarily securing a die to a burn-in carrier | John O. Jacobson | 2006-09-12 |
| 7087116 | Apparatus for modifying the configuration of an exposed surface of a viscous fluid | Syed Sajid Ahmad, Gregory M. Chapman, Tongbi Jiang | 2006-08-08 |
| 7082681 | Methods for modifying a vertical surface mount package | Larry D. Kinsman, Warren M. Farnworth | 2006-08-01 |
| 7065868 | Methods for installing a circuit device | Larry D. Kinsman, Mike Brooks, Warren M. Farnworth, Terry R. Lee | 2006-06-27 |
| 6979598 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Syed Sajid Ahmad | 2005-12-27 |
| 6974725 | Interconnections for a semiconductor device | Larry D. Kinsman, Warren M. Farnworth | 2005-12-13 |
| 6970359 | Reduced-sized memory card package, length-extending adaptor and method of forming adaptor | Derek Gochnour, Michael W. Morrison | 2005-11-29 |
| 6969632 | Method for fabricating image sensor semiconductor package | — | 2005-11-29 |
| 6963128 | Vertically mountable and alignable semiconductor device assembly | Larry D. Kinsman, Warren M. Farnworth | 2005-11-08 |
| 6917090 | Chip scale image sensor package | — | 2005-07-12 |
| 6903465 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Larry D. Kinsman | 2005-06-07 |
| 6894521 | Burn-in carrier for a semiconductor die | John O. Jacobson | 2005-05-17 |
| 6890384 | Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid | Syed Sajid Ahmad, Gregory M. Chapman, Tongbi Jiang | 2005-05-10 |
| 6876562 | Apparatus and method for mounting microelectronic devices on a mirrored board assembly | Chris G. Martin, Brent Keeth, Brian Johnson | 2005-04-05 |
| 6865086 | Apparatus and method to secure an adaptor to a reduced-sized memory card | Derek Gochnour, Michael W. Morrison | 2005-03-08 |
| 6861290 | Flip-chip adaptor package for bare die | — | 2005-03-01 |
| 6858926 | Stackable ceramic FBGA for high thermal applications | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2005-02-22 |
| 6858467 | Method for fabricating semiconductor packages with stacked dice and leadframes | — | 2005-02-22 |
| 6838768 | Module assembly for stacked BGA packages | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2005-01-04 |