Issued Patents All Time
Showing 76–100 of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6625885 | Method of making an electrical contact device | — | 2003-09-30 |
| 6611058 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2003-08-26 |
| 6589810 | BGA package and method of fabrication | — | 2003-07-08 |
| 6577503 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Jerry M. Brooks | 2003-06-10 |
| 6563217 | Module assembly for stacked BGA packages | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2003-05-13 |
| 6558966 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Larry D. Kinsman | 2003-05-06 |
| 6551845 | Method of temporarily securing a die to a burn-in carrier | John O. Jacobson | 2003-04-22 |
| 6552427 | BGA package and method of fabrication | — | 2003-04-22 |
| 6549421 | Stackable ball grid array package | David J. Corisis, Jerry M. Brooks | 2003-04-15 |
| 6538463 | Semiconductor die and retaining fixture | John O. Jacobson | 2003-03-25 |
| 6538200 | Underfill coating for LOC package | — | 2003-03-25 |
| 6537100 | Apparatus and method for packaging circuits | — | 2003-03-25 |
| 6531764 | Vertically mountable semiconductor device, assembly, and methods | Larry D. Kinsman, Warren M. Farnworth | 2003-03-11 |
| 6525943 | Heat sink with alignment and retaining features | David J. Corisis, Larry D. Kinsman, Leonard E. Mess | 2003-02-25 |
| 6512303 | Flip chip adaptor package for bare die | — | 2003-01-28 |
| 6512302 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Larry D. Kinsman | 2003-01-28 |
| 6512290 | Vertically mountable and alignable semiconductor device, assembly, and methods | Larry D. Kinsman, Warren M. Farnworth | 2003-01-28 |
| 6511863 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Larry D. Kinsman | 2003-01-28 |
| 6506628 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Syed Sajid Ahmad | 2003-01-14 |
| 6506625 | Semiconductor package having stacked dice and leadframes and method of fabrication | — | 2003-01-14 |
| 6492728 | Vertical surface mount assembly | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2002-12-10 |
| 6489564 | Stress relieving tape bonding interconnect | — | 2002-12-03 |
| 6489186 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, J. Mike Brooks | 2002-12-03 |
| 6486546 | Low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2002-11-26 |
| 6485778 | Method of applying an adhesive material to lead fingers of a lead frame | Syed Sajid Ahmad, Gregory M. Chapman, Tongbi Jiang | 2002-11-26 |