Issued Patents All Time
Showing 126–150 of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6330159 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Jerry M. Brooks | 2001-12-11 |
| 6329709 | Interconnections for a semiconductor device | Larry D. Kinsman, Warren M. Farnworth | 2001-12-11 |
| 6326242 | Semiconductor package with heat sink and method of fabrication | Mike Brooks | 2001-12-04 |
| 6316292 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, J. Mike Brooks | 2001-11-13 |
| 6316717 | Heat sink for microchip application | David J. Corisis | 2001-11-13 |
| 6312977 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Syed Sajid Ahmad | 2001-11-06 |
| 6310288 | Underfill coating for loc package | — | 2001-10-30 |
| 6310390 | BGA package and method of fabrication | — | 2001-10-30 |
| 6303981 | Semiconductor package having stacked dice and leadframes and method of fabrication | — | 2001-10-16 |
| 6297546 | Underfill coating for LOC package | — | 2001-10-02 |
| 6297542 | Connecting a die in an integrated circuit module | Warren M. Farnworth, Larry D. Kinsman | 2001-10-02 |
| 6297548 | Stackable ceramic FBGA for high thermal applications | David J. Corisis, Leonard E. Mess, Larry D. Kinsman | 2001-10-02 |
| 6297960 | Heat sink with alignment and retaining features | David J. Corisis, Larry D. Kinsman, Leonard E. Mess | 2001-10-02 |
| 6295209 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Larry D. Kinsman | 2001-09-25 |
| 6294839 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Larry D. Kinsman | 2001-09-25 |
| 6291894 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Larry D. Kinsman | 2001-09-18 |
| 6268649 | Stackable ball grid array package | David J. Corisis, Jerry M. Brooks | 2001-07-31 |
| 6268655 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Larry D. Kinsman | 2001-07-31 |
| 6265766 | Flip chip adaptor package for bare die | — | 2001-07-24 |
| 6265773 | Vertically mountable and alignable semiconductor device, assembly, and methods | Larry D. Kinsman, Warren M. Farnworth | 2001-07-24 |
| 6258623 | Low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2001-07-10 |
| 6235551 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Larry D. Kinsman | 2001-05-22 |
| 6232146 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Larry D. Kinsman | 2001-05-15 |
| 6232666 | Interconnect for packaging semiconductor dice and fabricating BGA packages | David J. Corisis | 2001-05-15 |
| 6228677 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2001-05-08 |