Issued Patents All Time
Showing 176–199 of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6017776 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Syed Sajid Ahmad | 2000-01-25 |
| 6013535 | Method for applying adhesives to a lead frame | Syed Sajid Ahmad, Gregory M. Chapman, Tongbi Jiang | 2000-01-11 |
| 5995378 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Larry D. Kinsman | 1999-11-30 |
| 5960258 | Underfill coating for LOC package | — | 1999-09-28 |
| 5956236 | Integrated circuit package support system | David J. Corisis, Terry R. Lee | 1999-09-21 |
| 5945733 | Structure for attaching a semiconductor wafer section to a support | Tim J. Corbett | 1999-08-31 |
| 5944199 | Integrated circuit package support system | David J. Corisis, Terry R. Lee | 1999-08-31 |
| 5943557 | Method and structure for attaching a semiconductor die to a lead frame | — | 1999-08-24 |
| 5940277 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Larry D. Kinsman | 1999-08-17 |
| 5920123 | Multichip module assembly having via contacts and method of making the same | — | 1999-07-06 |
| 5895222 | Encapsulant dam standoff for shell-enclosed die assemblies | John O. Jacobson | 1999-04-20 |
| 5894167 | Encapsulant dam standoff for shell-enclosed die assemblies | John O. Jacobson | 1999-04-13 |
| 5760468 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, J. Mike Brooks | 1998-06-02 |
| 5733800 | Underfill coating for LOC package | — | 1998-03-31 |
| 5719440 | Flip chip adaptor package for bare die | — | 1998-02-17 |
| 5656551 | Method for attaching a semiconductor die to a support | Tim J. Corbett | 1997-08-12 |
| 5583372 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, J. Mike Brooks | 1996-12-10 |
| 5548160 | Method and structure for attaching a semiconductor die to a lead frame | Tim J. Corbett | 1996-08-20 |
| 5539251 | Tie bar over chip lead frame design | Robert E. Iverson | 1996-07-23 |
| 5304842 | Dissimilar adhesive die attach for semiconductor devices | Warren M. Farnworth, Rockwell Smith | 1994-04-19 |
| 5286679 | Method for attaching a semiconductor die to a leadframe using a patterned adhesive layer | Warren M. Farnworth, Ed A. Shrock, Scott Clifford, Jerrold L. King | 1994-02-15 |
| 5214845 | Method for producing high speed integrated circuits | Jerrold L. King, Chender Huang | 1993-06-01 |
| 5177032 | Method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape | Rich Fogal, Jerrold L. King | 1993-01-05 |
| 5140404 | Semiconductor device manufactured by a method for attaching a semiconductor die to a leadframe using a thermoplastic covered carrier tape | Rich Fogal, Jerrold L. King | 1992-08-18 |