Issued Patents All Time
Showing 151–175 of 199 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6225689 | Low profile multi-IC chip package connector | Jerrold L. King, Jerry M. Brooks | 2001-05-01 |
| 6215183 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2001-04-10 |
| 6200833 | Method of attaching a leadframe to singulated semiconductor dice | Tongbi Jiang, Syed Sajid Ahmad | 2001-03-13 |
| 6201304 | Flip chip adaptor package for bare die | — | 2001-03-13 |
| 6198636 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Larry D. Kinsman | 2001-03-06 |
| 6191474 | Vertically mountable interposer assembly and method | Larry D. Kinsman, Warren M. Farnworth | 2001-02-20 |
| 6179659 | Electrical contact device and associated method of manufacture | — | 2001-01-30 |
| 6153929 | Low profile multi-IC package connector | Jerrold L. King, Jerry M. Brooks | 2000-11-28 |
| 6144560 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Larry D. Kinsman | 2000-11-07 |
| 6134111 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Jerry M. Brooks | 2000-10-17 |
| 6115254 | Vertical surface mount apparatus with thermal carrier | Larry D. Kinsman, Jerry M. Brooks | 2000-09-05 |
| 6114627 | Underfill coating for LOC package | — | 2000-09-05 |
| 6095822 | Component module holder | David J. Corisis, Larry D. Kinsman | 2000-08-01 |
| 6091606 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Larry D. Kinsman | 2000-07-18 |
| 6090644 | Underfill coating for LOC package | — | 2000-07-18 |
| 6088238 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Larry D. Kinsman | 2000-07-11 |
| 6087723 | Vertical surface mount assembly and methods | Larry D. Kinsman, Jerry M. Brooks, Warren M. Farnworth, Terry R. Lee | 2000-07-11 |
| 6088237 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Larry D. Kinsman | 2000-07-11 |
| 6072233 | Stackable ball grid array package | David J. Corisis, Jerry M. Brooks | 2000-06-06 |
| 6066514 | Adhesion enhanced semiconductor die for mold compound packaging | Jerrold L. King, J. Mike Brooks | 2000-05-23 |
| 6064221 | Method of temporarily securing a die to a burn-in carrier | John O. Jacobson | 2000-05-16 |
| 6061242 | Die paddle heat sink with thermal posts | David J. Corisis | 2000-05-09 |
| 6049125 | Semiconductor package with heat sink and method of fabrication | Mike Brooks | 2000-04-11 |
| 6046496 | Chip package | David J. Corisis | 2000-04-04 |
| 6031733 | Preventing movement of integrated circuit packages relative to their support surface | David J. Corisis, Terry R. Lee | 2000-02-29 |