Issued Patents All Time
Showing 76–100 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6838768 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2005-01-04 |
| 6833612 | Flip-chip image sensor packages | — | 2004-12-21 |
| 6828173 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Walter L. Moden | 2004-12-07 |
| 6825547 | Semiconductor device including edge bond pads | Warren M. Farnworth, Walter L. Moden | 2004-11-30 |
| 6803656 | Semiconductor device including combed bond pad opening | Warren M. Farnworth, Walter L. Moden | 2004-10-12 |
| 6800942 | Vertically mountable semiconductor device and methods | — | 2004-10-05 |
| 6800505 | Semiconductor device including edge bond pads and related methods | Warren M. Farnworth, Walter L. Moden | 2004-10-05 |
| 6797616 | Circuit boards containing vias and methods for producing same | — | 2004-09-28 |
| 6798063 | Low profile ball grid array package | — | 2004-09-28 |
| 6781839 | Vertical surface mount apparatus with thermal carrier and method | Jerry M. Brooks, Walter L. Moden | 2004-08-24 |
| 6780746 | Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom | Salman Akram | 2004-08-24 |
| 6777261 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Walter L. Moden | 2004-08-17 |
| 6774486 | Circuit boards containing vias and methods for producing same | — | 2004-08-10 |
| 6773965 | Semiconductor device, ball grid array connection system, and method of making | Salman Akram | 2004-08-10 |
| 6765803 | Semiconductor device socket | Warren M. Farnworth, Walter L. Moden | 2004-07-20 |
| 6760224 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2004-07-06 |
| 6744137 | Bumped die and wire bonded board-on-chip package | — | 2004-06-01 |
| 6737734 | Structure and method for securing bussing leads | Jerry M. Brooks, Timothy J. Allen | 2004-05-18 |
| 6735102 | 256 Meg dynamic random access memory | Brent Keeth, Layne Bunker | 2004-05-11 |
| 6734529 | Vertically mountable interposer and assembly | Walter L. Moden, Warren M. Farnworth | 2004-05-11 |
| 6730994 | Interdigitated capacitor design for integrated circuit lead frames and methods | — | 2004-05-04 |
| 6717245 | Chip scale packages performed by wafer level processing | Salman Akram | 2004-04-06 |
| 6709893 | Interconnections for a semiconductor device and method for forming same | Walter L. Moden, Warren M. Farnworth | 2004-03-23 |
| 6700206 | Stacked semiconductor package and method producing same | — | 2004-03-02 |
| 6699734 | Method and apparatus for coupling a semiconductor die to die terminals | Aaron Schoenfeld, Manny K. F. Ma, J. Mike Brooks, Timothy J. Allen | 2004-03-02 |