Issued Patents All Time
Showing 101–125 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6684493 | Vertically mountable interposer, assembly and method | Walter L. Moden, Warren M. Farnworth | 2004-02-03 |
| 6681480 | Method and apparatus for installing a circuit device | Mike Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2004-01-27 |
| 6682998 | Methods for bumped die and wire bonded board-on-chip package | — | 2004-01-27 |
| 6669738 | Low profile semiconductor package | Salman Akram | 2003-12-30 |
| 6650007 | Stackable ceramic fbga for high thermal applications | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2003-11-18 |
| 6635954 | Stress reduction feature for LOC lead frame | Timothy J. Allen, Jerry M. Brooks | 2003-10-21 |
| 6634098 | Methods for assembling, modifying and manufacturing a vertical surface mount package | Walter L. Moden, Warren M. Farnworth | 2003-10-21 |
| 6628136 | Method and apparatus for testing a semiconductor package | Stuart L. Roberts | 2003-09-30 |
| 6611058 | Vertical surface mount assembly and methods | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2003-08-26 |
| 6610162 | Methods for stress reduction feature for LOC lead frame | Timothy J. Allen, Jerry M. Brooks | 2003-08-26 |
| 6607943 | Low profile ball grid array package | — | 2003-08-19 |
| 6600215 | Method and apparatus for coupling a semiconductor die to die terminals | Aaron Schoenfeld, Manny K. F. Ma, J. Mike Brooks, Timothy J. Allen | 2003-07-29 |
| 6590277 | Reduced stress LOC assembly | Jerrold L. King, Jerry M. Brooks, David J. Corisis | 2003-07-08 |
| 6579746 | Method and apparatus for coupling a semiconductor die to die terminals | Aaron Schoenfeld, Manny K. F. Ma, J. Mike Brooks, Timothy J. Allen | 2003-06-17 |
| 6577503 | Vertical surface mount apparatus with thermal carrier | Jerry M. Brooks, Walter L. Moden | 2003-06-10 |
| 6563217 | Module assembly for stacked BGA packages | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2003-05-13 |
| 6563712 | Heak sink chip package | Salman Akram | 2003-05-13 |
| 6558966 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Walter L. Moden | 2003-05-06 |
| 6555399 | Double-packaged multichip semiconductor module | Alan G. Wood, Eugene H. Cloud | 2003-04-29 |
| 6545343 | Hybrid frame with lead-lock tape | Jerry M. Brooks, Timothy J. Allen | 2003-04-08 |
| 6541856 | Thermally enhanced high density semiconductor package | David J. Corisis, Mike Brooks, Mark S. Johnson | 2003-04-01 |
| 6534339 | Semiconductor device comprising a socket and method for forming same | Salman Akram | 2003-03-18 |
| 6531765 | Interdigitated capacitor design for integrated circuit lead frames and method | — | 2003-03-11 |
| 6531764 | Vertically mountable semiconductor device, assembly, and methods | Walter L. Moden, Warren M. Farnworth | 2003-03-11 |
| 6528408 | Method for bumped die and wire bonded board-on-chip package | — | 2003-03-04 |