Issued Patents All Time
Showing 151–175 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6380630 | Vertical surface mount package utilizing a back-to-back semiconductor device module | — | 2002-04-30 |
| 6380631 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Walter L. Moden | 2002-04-30 |
| 6372552 | Semiconductor device, ball grid array connection system, and method of making | Salman Akram | 2002-04-16 |
| 6365437 | Method of connecting a die in an integrated circuit module | Warren M. Farnworth, Walter L. Moden | 2002-04-02 |
| 6342731 | Vertically mountable semiconductor device, assembly, and methods | Walter L. Moden, Warren M. Farnworth | 2002-01-29 |
| 6330159 | Vertical surface mount apparatus with thermal carrier | Jerry M. Brooks, Walter L. Moden | 2001-12-11 |
| 6329709 | Interconnections for a semiconductor device | Walter L. Moden, Warren M. Farnworth | 2001-12-11 |
| 6320253 | Semiconductor device comprising a socket and method for forming same | Salman Akram | 2001-11-20 |
| 6314011 | 256 Meg dynamic random access memory | Brent Keeth, Layne Bunker, Ronald Taylor, John S. Mullin, Raymond J. Beffa +1 more | 2001-11-06 |
| 6306687 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Jerry M. Brooks | 2001-10-23 |
| 6297548 | Stackable ceramic FBGA for high thermal applications | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2001-10-02 |
| 6297542 | Connecting a die in an integrated circuit module | Warren M. Farnworth, Walter L. Moden | 2001-10-02 |
| 6297960 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2001-10-02 |
| 6295209 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Walter L. Moden | 2001-09-25 |
| 6294839 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Walter L. Moden | 2001-09-25 |
| 6291894 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Walter L. Moden | 2001-09-18 |
| 6277225 | Stress reduction feature for LOC lead frame | Timothy J. Allen, Jerry M. Brooks | 2001-08-21 |
| 6268650 | Semiconductor device, ball grid array connection system, and method of making | Salman Akram | 2001-07-31 |
| 6268655 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Walter L. Moden | 2001-07-31 |
| 6265764 | Interdigitated capacitor design for integrated circuit lead frames | — | 2001-07-24 |
| 6265773 | Vertically mountable and alignable semiconductor device, assembly, and methods | Walter L. Moden, Warren M. Farnworth | 2001-07-24 |
| 6251708 | Hybrid frame with lead-lock tape | Jerry M. Brooks, Timothy J. Allen | 2001-06-26 |
| 6246110 | Downset lead frame for semiconductor packages | Mark A. Wolfe | 2001-06-12 |
| 6239012 | Vertically mountable semiconductor device and methods | — | 2001-05-29 |
| 6235551 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Walter L. Moden | 2001-05-22 |