Issued Patents All Time
Showing 126–150 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6525943 | Heat sink with alignment and retaining features | Walter L. Moden, David J. Corisis, Leonard E. Mess | 2003-02-25 |
| 6518650 | Tape under frame for lead frame IC package assembly | David J. Corisis, Jerry M. Brooks | 2003-02-11 |
| 6512302 | Apparatus and methods of packaging and testing die | Leonard E. Mess, David J. Corisis, Walter L. Moden | 2003-01-28 |
| 6512290 | Vertically mountable and alignable semiconductor device, assembly, and methods | Walter L. Moden, Warren M. Farnworth | 2003-01-28 |
| 6511863 | Method and apparatus for a semiconductor package for vertical surface mounting | Warren M. Farnworth, Walter L. Moden | 2003-01-28 |
| 6506629 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Jerry M. Brooks | 2003-01-14 |
| 6507109 | Vertical surface mount package utilizing a back-to-back semiconductor device module | — | 2003-01-14 |
| 6495400 | Method of forming low profile semiconductor package | Salman Akram | 2002-12-17 |
| 6492728 | Vertical surface mount assembly | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2002-12-10 |
| 6493229 | Heat sink chip package | Salman Akram | 2002-12-10 |
| 6482674 | Semiconductor package having metal foil die mounting plate | — | 2002-11-19 |
| 6477073 | 256 meg dynamic random access memory | Brent Keeth, Layne Bunker | 2002-11-05 |
| 6455351 | Vertical surface mount assembly and methods | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2002-09-24 |
| 6442044 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Walter L. Moden | 2002-08-27 |
| 6437435 | Vertically mountable interposer, assembly and method | Walter L. Moden, Warren M. Farnworth | 2002-08-20 |
| 6426875 | Heat sink chip package | Salman Akram | 2002-07-30 |
| 6418023 | Vertical surface mount apparatus with thermal carrier | Jerry M. Brooks, Walter L. Moden | 2002-07-09 |
| 6417024 | Back-to-back semiconductor device module, assemblies including the same and methods | — | 2002-07-09 |
| 6414374 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Walter L. Moden | 2002-07-02 |
| 6414391 | Module assembly for stacked BGA packages with a common bus bar in the assembly | David J. Corisis, Walter L. Moden, Leonard E. Mess | 2002-07-02 |
| 6410406 | Semiconductor device including edge bond pads and methods | Warren M. Farnworth, Walter L. Moden | 2002-06-25 |
| 6408509 | Vertically mountable interposer, assembly and method | Walter L. Moden, Warren M. Farnworth | 2002-06-25 |
| 6396131 | Stress reduction feature for LOC lead frame | Timothy J. Allen, Jerry M. Brooks | 2002-05-28 |
| 6396134 | Interdigitated capacitor design for integrated circuit lead frames | — | 2002-05-28 |
| 6383839 | Vertically mountable semiconductor device and methods | — | 2002-05-07 |