Issued Patents All Time
Showing 176–200 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6232146 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Walter L. Moden | 2001-05-15 |
| 6228677 | Vertical surface mount assembly and methods | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2001-05-08 |
| 6215183 | Vertical surface mount assembly and methods | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2001-04-10 |
| 6215177 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Jerry M. Brooks | 2001-04-10 |
| 6215175 | Semiconductor package having metal foil die mounting plate | — | 2001-04-10 |
| 6198636 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Walter L. Moden | 2001-03-06 |
| 6191474 | Vertically mountable interposer assembly and method | Walter L. Moden, Warren M. Farnworth | 2001-02-20 |
| 6172419 | Low profile ball grid array package | — | 2001-01-09 |
| 6159764 | Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages | Jerry M. Brooks | 2000-12-12 |
| 6153924 | Multilayered lead frame for semiconductor package | — | 2000-11-28 |
| 6147411 | Vertical surface mount package utilizing a back-to-back semiconductor device module | — | 2000-11-14 |
| 6146922 | Hybrid frame with lead-lock tape | Jerry M. Brooks, Timothy J. Allen | 2000-11-14 |
| 6144560 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Walter L. Moden | 2000-11-07 |
| 6143589 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Jerry M. Brooks | 2000-11-07 |
| 6140696 | Vertically mountable semiconductor device and methods | — | 2000-10-31 |
| 6133068 | Increasing the gap between a lead frame and a semiconductor die | — | 2000-10-17 |
| 6134111 | Vertical surface mount apparatus with thermal carrier | Jerry M. Brooks, Walter L. Moden | 2000-10-17 |
| 6121673 | Leadframe finger support | — | 2000-09-19 |
| 6122171 | Heat sink chip package and method of making | Salman Akram | 2000-09-19 |
| 6114756 | Interdigitated capacitor design for integrated circuit leadframes | — | 2000-09-05 |
| 6114770 | Low profile semiconductor package | Salman Akram | 2000-09-05 |
| 6115254 | Vertical surface mount apparatus with thermal carrier | Jerry M. Brooks, Walter L. Moden | 2000-09-05 |
| 6095822 | Component module holder | David J. Corisis, Walter L. Moden | 2000-08-01 |
| 6091606 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Walter L. Moden | 2000-07-18 |
| 6091251 | Discrete die burn-in for nonpackaged die | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Chender Huang | 2000-07-18 |