Issued Patents All Time
Showing 226–232 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5342807 | Soft bond for semiconductor dies | Derek Gochnour, Alan G. Wood, Warren M. Farnworth | 1994-08-30 |
| 5336649 | Removable adhesives for attachment of semiconductor dies | Derek Gochnour, Alan G. Wood, Warren M. Farnworth | 1994-08-09 |
| 5302891 | Discrete die burn-in for non-packaged die | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Chender Huang | 1994-04-12 |
| 5173451 | Soft bond for semiconductor dies | Derek Gochnour | 1992-12-22 |
| 5155067 | Packaging for a semiconductor die | Alan G. Wood, Eugene H. Cloud | 1992-10-13 |
| 5107328 | Packaging means for a semiconductor die having particular shelf structure | — | 1992-04-21 |
| 4914269 | Method of sealing a ceramic lid on a ceramic semiconductor package with a high-power laser | Steven H. Laney, Wade D. Jorgensen | 1990-04-03 |