Issued Patents All Time
Showing 201–225 of 232 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6091250 | Discrete die burn-in for nonpackaged die | Alan G. Wood, Tim J. Corbett, Gary L. Chadwick, Chender Huang | 2000-07-18 |
| 6091133 | Assembly of a semiconductor device and paddleless lead frame having tape extending between the lead fingers | David J. Corisis, Jerry M. Brooks | 2000-07-18 |
| 6088238 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Walter L. Moden | 2000-07-11 |
| 6088237 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Walter L. Moden | 2000-07-11 |
| 6087723 | Vertical surface mount assembly and methods | Jerry M. Brooks, Warren M. Farnworth, Walter L. Moden, Terry R. Lee | 2000-07-11 |
| 6083777 | Reduced stress LOC assembly | Jerrold L. King, Jerry M. Brooks, David J. Corisis | 2000-07-04 |
| 6075283 | Downset lead frame for semiconductor packages | Mark A. Wolfe | 2000-06-13 |
| 6063650 | Reduced stress LOC assembly | Jerrold L. King, Jerry M. Brooks, David J. Corisis | 2000-05-16 |
| 6008531 | Hybrid frame with lead-lock tape | Jerry M. Brooks, Timothy J. Allen | 1999-12-28 |
| 6005286 | Increasing the gap between a lead frame and a semiconductor die | — | 1999-12-21 |
| 6002165 | Multilayered lead frame for semiconductor packages | — | 1999-12-14 |
| 5997378 | Method for evacuating and sealing field emission displays | Danny Dynka, David A. Cathey | 1999-12-07 |
| 5995378 | Semiconductor device socket, assembly and methods | Warren M. Farnworth, Walter L. Moden | 1999-11-30 |
| 5940277 | Semiconductor device including combed bond pad opening, assemblies and methods | Warren M. Farnworth, Walter L. Moden | 1999-08-17 |
| 5930602 | Leadframe finger support | — | 1999-07-27 |
| 5915166 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Jerry M. Brooks | 1999-06-22 |
| 5897340 | Hybrid frame with lead-lock tape | Jerry M. Brooks, Timothy J. Allen | 1999-04-27 |
| 5872398 | Reduced stress LOC assembly including cantilevered leads | Jerrold L. King, Jerry M. Brooks, David J. Corisis | 1999-02-16 |
| 5789803 | Semiconductor package | — | 1998-08-04 |
| 5788551 | Field emission display package and method of fabrication | Danny Dynka, David A. Cathey | 1998-08-04 |
| 5729049 | Tape under frame for conventional-type IC package assembly | David J. Corisis, Jerry M. Brooks | 1998-03-17 |
| 5717246 | Hybrid frame with lead-lock tape | Jerry M. Brooks, Timothy J. Allen | 1998-02-10 |
| 5697825 | Method for evacuating and sealing field emission displays | Danny Dynka, David A. Cathey | 1997-12-16 |
| 5696033 | Method for packaging a semiconductor die | — | 1997-12-09 |
| 5375320 | "Method of forming ""J"" leads on a semiconductor device" | Michael P. Grant, Gregory M. Chapman | 1994-12-27 |