Issued Patents All Time
Showing 51–75 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6363295 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2002-03-26 |
| 6353326 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, John O. Jacobson +2 more | 2002-03-05 |
| 6351034 | Clip chip carrier | Warren M. Farnworth, Alan G. Wood | 2002-02-26 |
| 6313651 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Warren M. Farnworth, Alan G. Wood, Salman Akram | 2001-11-06 |
| 6307394 | Test carrier with variable force applying mechanism for testing semiconductor components | Warren M. Farnworth, Salman Akram, James M. Wark | 2001-10-23 |
| 6300782 | System for testing semiconductor components having flexible interconnect | David R. Hembree | 2001-10-09 |
| 6297660 | Test carrier with variable force applying mechanism for testing semiconductor components | Warren M. Farnworth, Salman Akram, James M. Wark | 2001-10-02 |
| 6279563 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2001-08-28 |
| 6263566 | Flexible semiconductor interconnect fabricated by backslide thinning | David R. Hembree | 2001-07-24 |
| 6255840 | Semiconductor package with wire bond protective member | David R. Hembree, Salman Akram, Warren M. Farnworth | 2001-07-03 |
| 6255196 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2001-07-03 |
| 6250192 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2001-06-26 |
| 6247629 | Wire bond monitoring system for layered packages | John O. Jacobson, Steven G. Thummel | 2001-06-19 |
| 6242931 | Flexible semiconductor interconnect fabricated by backside thinning | David R. Hembree | 2001-06-05 |
| 6232243 | Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps | Warren M. Farnworth, Salman Akram | 2001-05-15 |
| 6224936 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2001-05-01 |
| 6208157 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Warren M. Farnworth, Alan G. Wood, John O. Jacobson | 2001-03-27 |
| 6196096 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2001-03-06 |
| 6180527 | Method and apparatus for thinning article, and article | Warren M. Farnworth | 2001-01-30 |
| 6155247 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2000-12-05 |
| 6119675 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2000-09-19 |
| 6085962 | Wire bond monitoring system for layered packages | John O. Jacobson, Steven G. Thummel | 2000-07-11 |
| 6072326 | System for testing semiconductor components | Salman Akram, David R. Hembree, Warren M. Farnworth, Alan G. Wood, John O. Jacobson | 2000-06-06 |
| 6057597 | Semiconductor package with pre-fabricated cover | Warren M. Farnworth, David R. Hembree, Salman Akram, John O. Jacobson, James M. Wark +1 more | 2000-05-02 |
| 6040702 | Carrier and system for testing bumped semiconductor components | David R. Hembree, Warren M. Farnworth, Alan G. Wood, Salman Akram | 2000-03-21 |