Issued Patents All Time
Showing 76–89 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6025728 | Semiconductor package with wire bond protective member | David R. Hembree, Salman Akram, Warren M. Farnworth | 2000-02-15 |
| 6025731 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, James M. Wark | 2000-02-15 |
| 6006739 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 1999-12-28 |
| 5962921 | Interconnect having recessed contact members with penetrating blades for testing semiconductor dice and packages with contact bumps | Warren M. Farnworth, Salman Akram | 1999-10-05 |
| 5915755 | Method for forming an interconnect for testing unpackaged semiconductor dice | Warren M. Farnworth | 1999-06-29 |
| 5907492 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 1999-05-25 |
| 5893726 | Semiconductor package with pre-fabricated cover and method of fabrication | Warren M. Farnworth, David R. Hembree, Salman Akram, John O. Jacobson, James M. Wark +1 more | 1999-04-13 |
| 5726075 | Method for fabricating microbump interconnect for bare semiconductor dice | Warren M. Farnworth, David R. Hembree | 1998-03-10 |
| 5678301 | Method for forming an interconnect for testing unpackaged semiconductor dice | Warren M. Farnworth | 1997-10-21 |
| 5653017 | Method of mechanical and electrical substrate connection | David A. Cathey, Charles M. Watkins | 1997-08-05 |
| 5537738 | Methods of mechanical and electrical substrate connection | David A. Cathey, Charles M. Watkins | 1996-07-23 |
| 5342807 | Soft bond for semiconductor dies | Larry D. Kinsman, Alan G. Wood, Warren M. Farnworth | 1994-08-30 |
| 5336649 | Removable adhesives for attachment of semiconductor dies | Larry D. Kinsman, Alan G. Wood, Warren M. Farnworth | 1994-08-09 |
| 5173451 | Soft bond for semiconductor dies | Larry D. Kinsman | 1992-12-22 |