Issued Patents All Time
Showing 26–50 of 89 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6703640 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | David R. Hembree, Salman Akram | 2004-03-09 |
| 6691696 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2004-02-17 |
| 6687990 | Sawing method employing multiple indexing techniques and semiconductor device structures fabricated thereby | Salman Akram, Michael E. Hess, David R. Hembree | 2004-02-10 |
| 6656754 | Method of forming a semiconductor chip carrier | Warren M. Farnworth, Alan G. Wood | 2003-12-02 |
| 6642730 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, John O. Jacobson +2 more | 2003-11-04 |
| 6631662 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2003-10-14 |
| 6630836 | CSP BGA test socket with insert | Warren M. Farnworth, David R. Hembree | 2003-10-07 |
| 6628128 | CSP BGA test socket with insert and method | Warren M. Farnworth, David R. Hembree | 2003-09-30 |
| 6598290 | Method of making a spring element for use in an apparatus for attaching to a semiconductor | David R. Hembree, Salman Akram | 2003-07-29 |
| 6592670 | Apparatus for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2003-07-15 |
| 6578458 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2003-06-17 |
| 6555400 | Method for substrate mapping | Warren M. Farnworth | 2003-04-29 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Salman Akram, Warren M. Farnworth, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2003-04-22 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Salman Akram, Warren M. Farnworth, Alan G. Wood, John O. Jacobson +2 more | 2003-04-08 |
| 6527999 | Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board | Leonard E. Mess | 2003-03-04 |
| 6493934 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2002-12-17 |
| 6459105 | Apparatus for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2002-10-01 |
| 6456100 | Apparatus for attaching to a semiconductor | David R. Hembree, Salman Akram | 2002-09-24 |
| 6441628 | CSP BGA test socket with insert and method | Warren M. Farnworth, David R. Hembree | 2002-08-27 |
| 6427676 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2002-08-06 |
| 6423616 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2002-07-23 |
| 6401580 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Salman Akram, Michael E. Hess, David R. Hembree | 2002-06-11 |
| 6396291 | Method for testing semiconductor components | Salman Akram, David R. Hembree, Warren M. Farnworth, Alan G. Wood, John O. Jacobson | 2002-05-28 |
| 6388458 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | David R. Hembree, Salman Akram | 2002-05-14 |
| 6369595 | CSP BGA test socket with insert and method | Warren M. Farnworth, David R. Hembree | 2002-04-09 |