Issued Patents All Time
Showing 51–75 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7918383 | Methods for placing substrates in contact with molten solder | Kyle K. Kirby, Daniel P. Cram, Roy Lange, Warren M. Farnworth | 2011-04-05 |
| 7892972 | Methods for fabricating and filling conductive vias and conductive vias so formed | William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2011-02-22 |
| 7858429 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, William M. Hiatt | 2010-12-28 |
| 7855140 | Method of forming vias in semiconductor substrates and resulting structures | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, Warren M. Farnworth | 2010-12-21 |
| 7855454 | Semiconductor device structures including nickel plated aluminum, copper, and tungsten structures | James M. Wark, William M. Hiatt | 2010-12-21 |
| 7842915 | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers | — | 2010-11-30 |
| 7829976 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2010-11-09 |
| 7829979 | High permeability layered films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2010-11-09 |
| 7791184 | Image sensor packages and frame structure thereof | Alan G. Wood, Kyle K. Kirby, Warren M. Farnworth | 2010-09-07 |
| 7772116 | Methods of forming blind wafer interconnects | Sidney B. Rigg | 2010-08-10 |
| 7759800 | Microelectronics devices, having vias, and packaged microelectronic devices having vias | Sidney B. Rigg, Charles M. Watkins, Kyle K. Kirby, Peter Benson | 2010-07-20 |
| 7759240 | Use of palladium in IC manufacturing with conductive polymer bump | Warren M. Farnworth | 2010-07-20 |
| 7732885 | Semiconductor structures with dual isolation structures, methods for forming same and systems including same | James Chapman | 2010-06-08 |
| 7727858 | Method for fabricating a chip scale package using wafer level processing | Larry D. Kinsman | 2010-06-01 |
| 7713841 | Methods for thinning semiconductor substrates that employ support structures formed on the substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more | 2010-05-11 |
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2010-05-04 |
| 7709279 | Methods for testing semiconductor devices methods for protecting the same from electrostatic discharge events during testing, and methods for fabricating inserts for use in testing semiconductor devices | David R. Hembree | 2010-05-04 |
| 7705349 | Test inserts and interconnects with electrostatic discharge structures | David R. Hembree | 2010-04-27 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2010-03-23 |
| 7646075 | Microelectronic imagers having front side contacts | — | 2010-01-12 |
| 7645635 | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages | Alan G. Wood, Kyle K. Kirby, Warren M. Farnworth | 2010-01-12 |
| 7602618 | Methods and apparatuses for transferring heat from stacked microfeature devices | David R. Hembree | 2009-10-13 |
| 7598167 | Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, Warren M. Farnworth | 2009-10-06 |
| 7592246 | Method and semiconductor device having copper interconnect for bonding | — | 2009-09-22 |
| 7569934 | Copper interconnect | — | 2009-08-04 |