Issued Patents All Time
Showing 76–100 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7561938 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs | Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2009-07-14 |
| 7547877 | Microelectronic imagers with integrated optical devices and methods for manufacturing such microelectronic imagers | — | 2009-06-16 |
| 7531453 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2009-05-12 |
| 7518227 | Multiple die stack apparatus employing T-shaped interposer elements | — | 2009-04-14 |
| 7517797 | Carrier for wafer-scale package, wafer-scale package including the carrier, and methods | — | 2009-04-14 |
| 7514291 | Methods relating to singulating semiconductor wafers and wafer scale assemblies | — | 2009-04-07 |
| 7511363 | Copper interconnect | — | 2009-03-31 |
| 7511262 | Optical device and assembly for use with imaging dies, and wafer-label imager assembly | — | 2009-03-31 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2009-03-17 |
| 7498647 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, William M. Hiatt | 2009-03-03 |
| 7489041 | Copper interconnect | — | 2009-02-10 |
| 7483286 | Semiconductor memory device with high permeability lines interposed between adjacent transmission lines | Leonard Forbes, Kie Y. Ahn | 2009-01-27 |
| 7443022 | Board-on-chip packages | — | 2008-10-28 |
| 7439158 | Strained semiconductor by full wafer bonding | Leonard Forbes, Joseph E. Geusic | 2008-10-21 |
| 7435620 | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects | Peter Benson | 2008-10-14 |
| 7419299 | Methods of sensing temperature of an electronic device workpiece | David R. Hembree | 2008-09-02 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2008-09-02 |
| 7419852 | Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies | Peter Benson | 2008-09-02 |
| 7413979 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Sidney B. Rigg, Charles M. Watkins, Kyle K. Kirby, Peter Benson | 2008-08-19 |
| 7391637 | Semiconductor memory device with high permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2008-06-24 |
| 7387119 | Dicing saw with variable indexing capability | Derek Gochnour, Michael E. Hess, David R. Hembree | 2008-06-17 |
| 7385412 | Systems and methods for testing microfeature devices | William M. Hiatt, Alan G. Wood, Charles M. Watkins, Kyle K. Kirby | 2008-06-10 |
| 7375414 | High permeability layered films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2008-05-20 |
| 7368812 | Interposers for chip-scale packages and intermediates thereof | — | 2008-05-06 |
| 7367845 | Modular sockets using flexible interconnects | Warren M. Farnworth, David J. Corisis | 2008-05-06 |