Issued Patents All Time
Showing 126–150 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7214962 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Alan G. Wood, Warren M. Farnworth | 2007-05-08 |
| 7205661 | Projected contact structures for engaging bumped semiconductor devices and methods of making the same | James M. Wark | 2007-04-17 |
| 7205221 | Under bump metallization pad and solder bump connections | Alan G. Wood | 2007-04-17 |
| 7199439 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Kyle K. Kirby, Peter Benson +4 more | 2007-04-03 |
| 7193306 | Semiconductor structure having stacked semiconductor devices | Jerry M. Brooks | 2007-03-20 |
| 7192311 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2007-03-20 |
| 7189954 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-03-13 |
| 7189623 | Semiconductor processing method and field effect transistor | Akram Ditali | 2007-03-13 |
| 7183191 | Method for fabricating a chip scale package using wafer level processing | Larry D. Kinsman | 2007-02-27 |
| 7169693 | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same | Syed Sajid Ahmad | 2007-01-30 |
| 7166925 | Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same | — | 2007-01-23 |
| 7166915 | Multi-chip module system | David R. Hembree, James M. Wark | 2007-01-23 |
| 7165322 | Process of forming socket contacts | Warren M. Farnworth | 2007-01-23 |
| 7162796 | Method of making an interposer with contact structures | James M. Wark | 2007-01-16 |
| 7161250 | Projected contact structures for engaging bumped semiconductor devices and methods of making the same | James M. Wark | 2007-01-09 |
| 7160795 | Method and structures for reduced parasitic capacitance in integrated circuit metallizations | Shubneesh Batra, Michael Chaine, Brent Keeth, Troy A. Manning, Brian Johnson +3 more | 2007-01-09 |
| 7159311 | Method of making an interposer with contact structures | James M. Wark | 2007-01-09 |
| 7157364 | Method for forming metal contacts on a substrate | — | 2007-01-02 |
| 7156362 | Method and apparatus for forming metal contacts on a substrate | — | 2007-01-02 |
| 7156361 | Method and apparatus for forming metal contacts on a substrate | — | 2007-01-02 |
| 7154354 | High permeability layered magnetic films to reduce noise in high speed interconnection | Kie Y. Ahn, Leonard Forbes | 2006-12-26 |
| 7153164 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2006-12-26 |
| 7155300 | Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2006-12-26 |
| 7148715 | Systems and methods for testing microelectronic imagers and microfeature devices | William M. Hiatt, Alan G. Wood, Charles M. Watkins, Kyle K. Kirby | 2006-12-12 |
| 7141994 | Air socket for testing integrated circuits | — | 2006-11-28 |