Issued Patents All Time
Showing 176–200 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7064006 | Multiple die stack apparatus employing T-shaped interposer elements | — | 2006-06-20 |
| 7061109 | Semiconductor substrate-based BGA interconnection for testing semiconductor devices | — | 2006-06-13 |
| 7061092 | High-density modularity for ICS | Jerry M. Brooks | 2006-06-13 |
| 7049840 | Hybrid interconnect and system for testing semiconductor dice | David R. Hembree, Warren M. Farnworth, Alan G. Wood, James M. Wark, Derek Gochnour | 2006-05-23 |
| 7049206 | Device isolation for semiconductor devices | — | 2006-05-23 |
| 7043831 | Method for fabricating a test interconnect for bumped semiconductor components by forming recesses and cantilevered leads on a substrate | Warren M. Farnworth | 2006-05-16 |
| 7041537 | Method for fabricating semiconductor component with on board capacitor | Mike Brooks | 2006-05-09 |
| 7041533 | Stereolithographic method for fabricating stabilizers for semiconductor devices | Syed Sajid Ahmad | 2006-05-09 |
| 7041513 | Methods for forming semiconductor devices so as to stabilize the same when positioned face-down over test substrates | — | 2006-05-09 |
| 7040930 | Modular sockets using flexible interconnects | Warren M. Farnworth, David J. Corisis | 2006-05-09 |
| 7033920 | Method for fabricating a silicon carbide interconnect for semiconductor components | Alan G. Wood | 2006-04-25 |
| 7011532 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | David R. Hembree, Derek Gochnour | 2006-03-14 |
| 7008824 | Method of fabricating mounted multiple semiconductor dies in a package | — | 2006-03-07 |
| 7008823 | Die stacking scheme | — | 2006-03-07 |
| 7002362 | Test system for bumped semiconductor components | Warren M. Farnworth | 2006-02-21 |
| 7002248 | Semiconductor components having multiple on board capacitors | Mike Brooks | 2006-02-21 |
| 6998344 | Method for fabricating semiconductor components by forming conductive members using solder | Warren M. Farnworth, Alan G. Wood | 2006-02-14 |
| 6995577 | Contact for semiconductor components | Warren M. Farnworth | 2006-02-07 |
| 6982564 | Semiconductor test interconnect with variable flexure contacts | Alan G. Wood | 2006-01-03 |
| 6979895 | Semiconductor assembly of stacked substrates and multiple semiconductor dice | Jerry M. Brooks | 2005-12-27 |
| 6979607 | Technique to control tunneling currents in DRAM capacitors, cells, and devices | Leonard Forbes | 2005-12-27 |
| 6980014 | Interposer and methods for fabricating same | Alan G. Wood, Warren M. Farnworth | 2005-12-27 |
| 6980017 | Test interconnect for bumped semiconductor components and method of fabrication | Warren M. Farnworth | 2005-12-27 |
| 6975030 | Silicon carbide contact for semiconductor components | Alan G. Wood | 2005-12-13 |
| 6972249 | Use of nitrides for flip-chip encapsulation | Warren M. Farnworth | 2005-12-06 |