Issued Patents All Time
Showing 151–175 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7138653 | Structures for stabilizing semiconductor devices relative to test substrates and methods for fabricating the stabilizers | — | 2006-11-21 |
| 7131195 | Method for forming metal contacts on a substrate | — | 2006-11-07 |
| 7129725 | Semiconductor test interconnect with variable flexure contacts having polymer material | Alan G. Wood | 2006-10-31 |
| 7129114 | Methods relating to singulating semiconductor wafers and wafer scale assemblies | — | 2006-10-31 |
| 7129156 | Method for fabricating a silicon carbide interconnect for semiconductor components using heating | Alan G. Wood | 2006-10-31 |
| 7126224 | Semiconductor substrate-based interconnection assembly for semiconductor device bearing external connection elements | — | 2006-10-24 |
| 7120513 | Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs | Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2006-10-10 |
| 7115495 | Methods of making projected contact structures for engaging bumped semiconductor devices | James M. Wark | 2006-10-03 |
| 7115961 | Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices | Charles M. Watkins, David R. Hembree, Peter Benson | 2006-10-03 |
| 7112878 | Die stacking scheme | — | 2006-09-26 |
| 7109068 | Through-substrate interconnect fabrication methods | Kyle K. Kirby | 2006-09-19 |
| 7105411 | Methods of forming a transistor gate | Akram Ditali | 2006-09-12 |
| 7095106 | Collars, support structures, and forms for protruding conductive structures | Syed Sajid Ahmad | 2006-08-22 |
| 7094108 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2006-08-22 |
| 7093358 | Method for fabricating an interposer | Alan G. Wood, Warren M. Farnworth | 2006-08-22 |
| 7091622 | Semiconductor device, ball grid array connection system, and method of making | Larry D. Kinsman | 2006-08-15 |
| 7091124 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Sidney B. Rigg, Charles M. Watkins, Kyle K. Kirby, Peter Benson | 2006-08-15 |
| 7090750 | Plating | David R. Hembree | 2006-08-15 |
| 7087984 | Methods for protecting intermediate conductive elements of semiconductor device assemblies | — | 2006-08-08 |
| 7087511 | Method for conducting heat in a flip-chip assembly | Alan G. Wood | 2006-08-08 |
| 7084351 | Electrical device allowing for increased device densities | Warren M. Farnworth, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2006-08-01 |
| 7084012 | Programmed material consolidation processes for protecting intermediate conductive structures | — | 2006-08-01 |
| 7082033 | Removing heat from integrated circuit devices mounted on a support structure | — | 2006-07-25 |
| 7071557 | Metallization structures for semiconductor device interconnects, methods for making same, and semiconductor devices including same | — | 2006-07-04 |
| 7069638 | Air socket for testing integrated circuits | — | 2006-07-04 |