Issued Patents All Time
Showing 101–125 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7358596 | Device isolation for semiconductor devices | — | 2008-04-15 |
| 7345358 | Copper interconnect for semiconductor device | — | 2008-03-18 |
| 7341881 | Methods of packaging and testing microelectronic imaging devices | Charles M. Watkins, David R. Hembree, Peter Benson | 2008-03-11 |
| 7338889 | Method of improving copper interconnects of semiconductor devices for bonding | — | 2008-03-04 |
| 7335988 | Use of palladium in IC manufacturing with conductive polymer bump | Warren M. Farnworth | 2008-02-26 |
| 7335968 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2008-02-26 |
| 7329943 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2008-02-12 |
| 7327016 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2008-02-05 |
| 7317322 | Interconnect for bumped semiconductor components | Warren M. Farnworth | 2008-01-08 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2007-11-27 |
| 7294897 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, William M. Hiatt | 2007-11-13 |
| 7282793 | Multiple die stack apparatus employing T-shaped interposer elements | — | 2007-10-16 |
| 7282794 | Multiple die stack apparatus employing t-shaped interposer elements | — | 2007-10-16 |
| 7279407 | Selective nickel plating of aluminum, copper, and tungsten structures | James M. Wark, William M. Hiatt | 2007-10-09 |
| 7271491 | Carrier for wafer-scale package and wafer-scale package including the carrier | — | 2007-09-18 |
| 7265330 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-09-04 |
| 7259578 | System for testing semiconductor components having interconnect with variable flexure contacts | Alan G. Wood | 2007-08-21 |
| 7256069 | Wafer-level package and methods of fabricating | Alan G. Wood | 2007-08-14 |
| 7253957 | Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers | Peter Benson | 2007-08-07 |
| 7250780 | Probe card for semiconductor wafers having mounting plate and socket | David R. Hembree, Warren M. Farnworth, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2007-07-31 |
| 7235837 | Technique to control tunneling currents in DRAM capacitors, cells, and devices | Leonard Forbes | 2007-06-26 |
| 7235457 | High permeability layered films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2007-06-26 |
| 7233158 | Air socket for testing integrated circuits | — | 2007-06-19 |
| 7232754 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Kyle K. Kirby, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2007-06-19 |
| 7217597 | Die stacking scheme | — | 2007-05-15 |