Issued Patents All Time
Showing 201–225 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6970053 | Atomic layer deposition (ALD) high permeability layered magnetic films to reduce noise in high speed interconnection | Kie Y. Ahn, Leonard Forbes | 2005-11-29 |
| 6963127 | Protective structures for bond wires | — | 2005-11-08 |
| 6960924 | Electrical contact | — | 2005-11-01 |
| 6955979 | Methods for making metallization structures for semiconductor device interconnects | — | 2005-10-18 |
| 6953995 | Hermetic chip in wafer form | Warren M. Farnworth, Alan G. Wood | 2005-10-11 |
| 6952054 | Semiconductor package having interconnect with conductive members | Warren M. Farnworth, Alan G. Wood | 2005-10-04 |
| 6946732 | Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same | Syed Sajid Ahmad | 2005-09-20 |
| 6946378 | Methods for fabricating protective structures for bond wires | — | 2005-09-20 |
| 6939145 | Spring element for use in an apparatus for attaching to a semiconductor and a method of making | David R. Hembree, Derek Gochnour | 2005-09-06 |
| 6939744 | Use of palladium in IC manufacturing with conductive polymer bump | Warren M. Farnworth | 2005-09-06 |
| 6932077 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions and dicing apparatus | Derek Gochnour, Michael E. Hess, David R. Hembree | 2005-08-23 |
| 6919220 | Method of making chip package with grease heat sink | — | 2005-07-19 |
| 6917107 | Board-on-chip packages | — | 2005-07-12 |
| 6913997 | Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices | Scott Meikle | 2005-07-05 |
| 6914198 | Electrical device allowing for increased device densities | Warren M. Farnworth, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2005-07-05 |
| 6914278 | High permeability thin films and patterned thin films to reduce noise in high speed interconnections | Leonard Forbes, Kie Y. Ahn | 2005-07-05 |
| 6913988 | Methods for fabricating semiconductor device test apparatus that include protective structures for intermediate conductive elements | — | 2005-07-05 |
| 6911723 | Multiple die stack apparatus employing T-shaped interposer elements | — | 2005-06-28 |
| 6911735 | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same | Syed Sajid Ahmad | 2005-06-28 |
| 6909055 | Electrical device allowing for increased device densities | Warren M. Farnworth, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2005-06-21 |
| 6909196 | Method and structures for reduced parasitic capacitance in integrated circuit metallizations | Shubneesh Batra, Michael Chaine, Brent Keeth, Troy A. Manning, Brian Johnson +3 more | 2005-06-21 |
| 6906417 | Ball grid array utilizing solder balls having a core material covered by a metal layer | Tongbi Jiang | 2005-06-14 |
| 6906402 | High permeability thin films and patterned thin films to reduce noise in high speed interconnections | Leonard Forbes, Kie Y. Ahn | 2005-06-14 |
| 6903444 | High permeability thin films and patterned thin films to reduce noise in high speed interconnections | Leonard Forbes, Kie Y. Ahn | 2005-06-07 |
| 6903003 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2005-06-07 |