Issued Patents All Time
Showing 251–275 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6847110 | Method and apparatus for conducting heat in a flip-chip assembly | Alan G. Wood | 2005-01-25 |
| 6846738 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2005-01-25 |
| 6844256 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2005-01-18 |
| 6841868 | Memory modules including capacity for additional memory | James M. Wark, David R. Hembree | 2005-01-11 |
| 6835643 | Method of improving copper interconnects of semiconductor devices for bonding | — | 2004-12-28 |
| 6833613 | Stacked semiconductor package having laser machined contacts | Warren M. Farnworth, Alan G. Wood | 2004-12-21 |
| 6833317 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2004-12-21 |
| 6831472 | Method of forming an electrical contact | — | 2004-12-14 |
| 6825550 | Board-on-chip packages with conductive foil on the chip surface | — | 2004-11-30 |
| 6815804 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2004-11-09 |
| 6815817 | Underfill of a bumped or raised die utilizing barrier adjacent to the side wall of a flip-chip | James M. Wark | 2004-11-09 |
| 6815251 | High density modularity for IC's | Jerry M. Brooks | 2004-11-09 |
| 6815314 | Hermetic chip and method of manufacture | Warren M. Farnworth, Alan G. Wood | 2004-11-09 |
| 6812146 | Chemical vapor deposition process for depositing titanium nitride films from an organo-metallic compound | — | 2004-11-02 |
| 6806493 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | David R. Hembree, Derek Gochnour | 2004-10-19 |
| 6798224 | Method for testing semiconductor wafers | David R. Hembree, Warren M. Farnworth, Alan G. Wood, C. Patrick Doherty, Andrew J. Krivy | 2004-09-28 |
| 6794735 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2004-09-21 |
| 6794749 | Chip package with grease heat sink | — | 2004-09-21 |
| 6794224 | SEMICONDUCTOR DEVICE INCLUDING LEADS IN COMMUNICATION WITH CONTACT PADS THEREOF AND A STEREOLITHOGRAPHICALLY FABRICATED PACKAGE SUBSTANTIALLY ENCAPSULATING THE LEADS AND METHODS FOR FABRICATING THE SAME | — | 2004-09-21 |
| 6791185 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Alan G. Wood, Warren M. Farnworth | 2004-09-14 |
| 6787888 | High permeability composite films to reduce noise in high speed interconnects | Leonard Forbes, Kie Y. Ahn | 2004-09-07 |
| 6782613 | Method of making an interposer with contact structures | James M. Wark | 2004-08-31 |
| 6785144 | High density stackable and flexible substrate-based devices and systems and methods of fabricating | — | 2004-08-31 |
| 6780746 | Method for fabricating a chip scale package using wafer level processing and devices resulting therefrom | Larry D. Kinsman | 2004-08-24 |
| 6773965 | Semiconductor device, ball grid array connection system, and method of making | Larry D. Kinsman | 2004-08-10 |