Issued Patents All Time
Showing 276–300 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6762502 | Semiconductor device packages including a plurality of layers substantially encapsulating leads thereof | — | 2004-07-13 |
| 6760970 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2004-07-13 |
| 6758696 | Method and apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2004-07-06 |
| 6751859 | Method for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2004-06-22 |
| 6744346 | Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece | David R. Hembree | 2004-06-01 |
| 6740578 | Methods of fabricating semiconductor substrate-based BGA interconnections | — | 2004-05-25 |
| 6735855 | Methods for electrical connector | David R. Hembree, Warren M. Farnworth | 2004-05-18 |
| 6730543 | Methods for multiple die stack apparatus employing | — | 2004-05-04 |
| 6730526 | Multi-chip module system and method of fabrication | David R. Hembree, James M. Wark | 2004-05-04 |
| 6729027 | Method of forming recessed socket contacts | Warren M. Farnworth | 2004-05-04 |
| 6725536 | Methods for the fabrication of electrical connectors | David R. Hembree, Warren M. Farnworth | 2004-04-27 |
| 6720652 | Apparatus providing redundancy for fabricating highly reliable memory modules | James M. Wark, David R. Hembree | 2004-04-13 |
| 6717422 | Air socket for testing integrated circuits | — | 2004-04-06 |
| 6717245 | Chip scale packages performed by wafer level processing | Larry D. Kinsman | 2004-04-06 |
| 6716745 | Silicide pattern structures and methods of fabricating the same | Y. Jeff Hu | 2004-04-06 |
| 6713879 | Semiconductor substract with substantially matched lines | John O. Jacobson | 2004-03-30 |
| 6709878 | Electronic device workpieces, methods of semiconductor processing and methods of sensing temperature of an electronic device workpiece | David R. Hembree | 2004-03-23 |
| 6708399 | Method for fabricating a test interconnect for bumped semiconductor components | Warren M. Farnworth | 2004-03-23 |
| 6707141 | Multi-chip module substrate for use with leads-over chip type semiconductor devices | — | 2004-03-16 |
| 6703714 | Methods for fabricating flip-chip devices and preventing coupling between signal interconnections | John O. Jacobson | 2004-03-09 |
| 6703640 | Spring element for use in an apparatus for attaching to a semiconductor and a method of attaching | David R. Hembree, Derek Gochnour | 2004-03-09 |
| 6696669 | Circuit and method for heating an adhesive to package or rework a semiconductor die | David R. Hembree | 2004-02-24 |
| 6696109 | Chemical vapor deposition process for depositing titanium silicide films from an organometallic compound | — | 2004-02-24 |
| 6693349 | Semiconductor chip package having a leadframe with a footprint of about the same size as the chip | — | 2004-02-17 |
| 6691696 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2004-02-17 |