Issued Patents All Time
Showing 326–350 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6620654 | Method for fabricating a simplified CMOS polysilicon thin film transistor and resulting structure | — | 2003-09-16 |
| 6617684 | Packaged die on PCB with heat sink encapsulant | James M. Wark | 2003-09-09 |
| 6617687 | Method of forming a test insert for interfacing a device containing contact bumps with a test substrate | David R. Hembree | 2003-09-09 |
| 6617671 | High density stackable and flexible substrate-based semiconductor device modules | — | 2003-09-09 |
| 6612027 | Method for forming metal contacts on a substrate | — | 2003-09-02 |
| 6612872 | Apparatus for forming modular sockets using flexible interconnects and resulting structures | Warren M. Farnworth, David J. Corisis | 2003-09-02 |
| 6613662 | Method for making projected contact structures for engaging bumped semiconductor devices | James M. Wark | 2003-09-02 |
| 6611053 | Protective structure for bond wires | — | 2003-08-26 |
| 6610591 | Methods of ball grid array | Tongbi Jiang | 2003-08-26 |
| 6611061 | Tantalum-aluminum-nitrogen material for semiconductor devices | Scott Meikle | 2003-08-26 |
| 6605205 | Method for continuous processing of semiconductor wafers | David R. Hembree | 2003-08-12 |
| 6603198 | Semiconductor structure having stacked semiconductor devices | Jerry M. Brooks | 2003-08-05 |
| 6599832 | Silicide pattern structures and methods of fabricating the same | Y. Jeff Hu | 2003-07-29 |
| 6599822 | Methods of fabricating semiconductor substrate-based BGA interconnection | — | 2003-07-29 |
| 6599776 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Alan G. Wood, Warren M. Farnworth | 2003-07-29 |
| 6598290 | Method of making a spring element for use in an apparatus for attaching to a semiconductor | David R. Hembree, Derek Gochnour | 2003-07-29 |
| 6597066 | Hermetic chip and method of manufacture | Warren M. Farnworth, Alan G. Wood | 2003-07-22 |
| 6593196 | Methods of forming a transistor gate | Akram Ditali | 2003-07-15 |
| 6583503 | Semiconductor package with stacked substrates and multiple semiconductor dice | Jerry M. Brooks | 2003-06-24 |
| 6578458 | Method for sawing wafers employing multiple indexing techniques for multiple die dimensions | Derek Gochnour, Michael E. Hess, David R. Hembree | 2003-06-17 |
| 6576993 | Packages formed by attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip | — | 2003-06-10 |
| 6570251 | Under bump metalization pad and solder bump connections | Alan G. Wood | 2003-05-27 |
| 6569753 | Collar positionable about a periphery of a contact pad and around a conductive structure secured to the contact pads, semiconductor device components including same, and methods for fabricating same | Syed Sajid Ahmad | 2003-05-27 |
| 6563712 | Heak sink chip package | Larry D. Kinsman | 2003-05-13 |
| 6563215 | Silicon carbide interconnect for semiconductor components and method of fabrication | Alan G. Wood | 2003-05-13 |