Issued Patents All Time
Showing 351–375 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6563712 | Heak sink chip package | Larry D. Kinsman | 2003-05-13 |
| 6562637 | Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer | Alan G. Wood, Warren M. Farnworth | 2003-05-13 |
| 6558979 | Use of palladium in IC manufacturing with conductive polymer bump | Warren M. Farnworth | 2003-05-06 |
| 6556030 | Method of forming an electrical contact | — | 2003-04-29 |
| 6553276 | Method of using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs | Warren M. Farnworth, Derek Gochnour, David R. Hembree, Michael E. Hess, John O. Jacobson +2 more | 2003-04-22 |
| 6548392 | Methods of a high density flip chip memory arrays | Warren M. Farnworth, Alan G. Wood | 2003-04-15 |
| 6545356 | Graded layer for use in semiconductor circuits and method for making same | Scott Meikle | 2003-04-08 |
| 6544461 | Test carrier with molded interconnect for testing semiconductor components | David R. Hembree, Warren M. Farnworth, Alan G. Wood, Derek Gochnour, John O. Jacobson +2 more | 2003-04-08 |
| 6544821 | Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed | — | 2003-04-08 |
| 6544880 | Method of improving copper interconnects of semiconductor devices for bonding | — | 2003-04-08 |
| 6541303 | Method for conducting heat in a flip-chip assembly | Alan G. Wood | 2003-04-01 |
| 6541812 | Capacitor and method for forming the same | — | 2003-04-01 |
| 6538334 | High density flip chip memory arrays | Warren M. Farnworth, Alan G. Wood | 2003-03-25 |
| 6537856 | Method of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby | — | 2003-03-25 |
| 6537842 | Methods for fabricating protective structures for bond wires | — | 2003-03-25 |
| 6535393 | Electrical device allowing for increased device densities | Warren M. Farnworth, Alan G. Wood, J. Michael Brooks, Eugene H. Cloud | 2003-03-18 |
| 6534858 | Assembly and methods for packaged die on pcb with heat sink encapsulant | James M. Wark | 2003-03-18 |
| 6534339 | Semiconductor device comprising a socket and method for forming same | Larry D. Kinsman | 2003-03-18 |
| 6531772 | Electronic system including memory module with redundant memory capability | James M. Wark, David R. Hembree | 2003-03-11 |
| 6531338 | Method of manufacturing a semiconductor structure having stacked semiconductor devices | Jerry M. Brooks | 2003-03-11 |
| 6531337 | Method of manufacturing a semiconductor structure having stacked semiconductor devices | Jerry M. Brooks | 2003-03-11 |
| 6531192 | Chemical vapor deposition process for depositing titanium nitride films from an organo-metallic compound | — | 2003-03-11 |
| 6529027 | Interposer and methods for fabricating same | Alan G. Wood, Warren M. Farnworth | 2003-03-04 |
| 6528894 | Use of nitrides for flip-chip encapsulation | Warren M. Farnworth | 2003-03-04 |
| 6529026 | Method for fabricating an interconnect for making temporary electrical connections to semiconductor components | Warren M. Farnworth | 2003-03-04 |