Issued Patents All Time
Showing 26–50 of 726 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8816463 | Wafer-level packaged microelectronic imagers having interconnects formed through terminals | Peter Benson, Warren M. Farnworth, William M. Hiatt | 2014-08-26 |
| 8786097 | Method of forming vias in semiconductor substrates and resulting structures | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, Warren M. Farnworth | 2014-07-22 |
| 8759970 | Semiconductor device having copper interconnect for bonding | — | 2014-06-24 |
| 8703518 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, William M. Hiatt | 2014-04-22 |
| 8669179 | Through-wafer interconnects for photoimager and memory wafers | Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2014-03-11 |
| 8647982 | Methods of forming interconnects in a semiconductor structure | James M. Wark, William M. Hiatt | 2014-02-11 |
| 8637962 | Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate | Sidney B. Rigg | 2014-01-28 |
| 8502353 | Through-wafer interconnects for photoimager and memory wafers | Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2013-08-06 |
| 8470687 | Strained semiconductor by full wafer bonding | Leonard Forbes, Joseph E. Geusic | 2013-06-25 |
| 8389920 | Method and apparatus for breaking surface tension during a recessed color filter array process | James Chapman | 2013-03-05 |
| 8324100 | Methods of forming conductive vias | William M. Hiatt, Steven Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2012-12-04 |
| 8324101 | Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate | Sidney B. Rigg | 2012-12-04 |
| 8294273 | Methods for fabricating and filling conductive vias and conductive vias so formed | William M. Hiatt, Steve Oliver, Alan G. Wood, Sidney B. Rigg, James M. Wark +1 more | 2012-10-23 |
| 8129764 | Imager devices having differing gate stack sidewall spacers, method for forming such imager devices, and systems including such imager devices | — | 2012-03-06 |
| 8111515 | Methods and apparatuses for transferring heat from stacked microfeature devices | David R. Hembree | 2012-02-07 |
| 8053857 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Charles M. Watkins, Kyle K. Kirby, Alan G. Wood, William M. Hiatt | 2011-11-08 |
| 8035179 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Kyle K. Kirby, William M. Hiatt | 2011-10-11 |
| 7994595 | Strained semiconductor by full wafer bonding | Leonard Forbes, Joseph E. Geusic | 2011-08-09 |
| 7994547 | Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects | Peter Benson | 2011-08-09 |
| 7989345 | Methods of forming blind wafer interconnects, and related structures and assemblies | Sidney B. Rigg | 2011-08-02 |
| 7989311 | Strained semiconductor by full wafer bonding | Leonard Forbes, Joseph E. Geusic | 2011-08-02 |
| 7960829 | Support structure for use in thinning semiconductor substrates and for supporting thinned semiconductor substrates | Alan G. Wood, Warren M. Farnworth, David R. Hembree, Sidney B. Rigg, William M. Hiatt +2 more | 2011-06-14 |
| 7956443 | Through-wafer interconnects for photoimager and memory wafers | Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark, Warren M. Farnworth +6 more | 2011-06-07 |
| 7952158 | Elevated pocket pixels, imaging devices and systems including the same and method of forming the same | — | 2011-05-31 |
| 7919348 | Methods for protecting imaging elements of photoimagers during back side processing | Kyle K. Kirby | 2011-04-05 |