| 8470687 |
Strained semiconductor by full wafer bonding |
Leonard Forbes, Salman Akram |
2013-06-25 |
$5,511,000 |
| 7994595 |
Strained semiconductor by full wafer bonding |
Leonard Forbes, Salman Akram |
2011-08-09 |
$2,316,000 |
| 7989311 |
Strained semiconductor by full wafer bonding |
Leonard Forbes, Salman Akram |
2011-08-02 |
$1,985,000 |
| 7964124 |
Method of forming cellular material |
— |
2011-06-21 |
$3,062,000 |
| 7564082 |
Gettering using voids formed by surface transformation |
Leonard Forbes |
2009-07-21 |
$5,334,000 |
| 7550824 |
Low k interconnect dielectric using surface transformation |
Paul A. Farrar, Arup Bhattacharyya |
2009-06-23 |
$3,802,000 |
| 7547954 |
Electronic systems using optical waveguide interconnects formed through a semiconductor wafer |
Kie Y. Ahn, Leonard Forbes |
2009-06-16 |
$3,517,000 |
| 7544984 |
Gettering using voids formed by surface transformation |
Leonard Forbes |
2009-06-09 |
$3,596,000 |
| 7512170 |
Method of forming mirrors by surface transformation of empty spaces in solid state materials |
Eugene P. Marsh |
2009-03-31 |
$2,372,000 |
| 7492042 |
Integrated circuit cooling and insulating device and method |
Paul A. Farrar, Leonard Forbes, Kie Y. Ahn, Arup Bhattacharyya, Alan R. Reinberg |
2009-02-17 |
$2,179,000 |
| 7485497 |
Integrated circuit cooling and insulating device and method |
Paul A. Farrar, Leonard Forbes, Kie Y. Ahn, Arup Bhattacharyya, Alan R. Reinberg |
2009-02-03 |
$2,699,000 |
| 7439158 |
Strained semiconductor by full wafer bonding |
Leonard Forbes, Salman Akram |
2008-10-21 |
$1,313,000 |
| 7408216 |
Device, system, and method for a trench capacitor having micro-roughened semiconductor surfaces |
Leonard Forbes, Kie Y. Ahn |
2008-08-05 |
$1,916,000 |
| 7326597 |
Gettering using voids formed by surface transformation |
Leonard Forbes |
2008-02-05 |
$1,645,000 |
| 7304380 |
Integrated circuit cooling and insulating device and method |
Paul A. Farrar, Leonard Forbes, Kie Y. Ahn, Arup Bhattacharyya, Alan R. Reinberg |
2007-12-04 |
$3,453,000 |
| 7300821 |
Integrated circuit cooling and insulating device and method |
Paul A. Farrar, Leonard Forbes, Kie Y. Ahn, Arup Bhattacharyya, Alan R. Reinberg |
2007-11-27 |
$3,989,000 |
| 7260125 |
Method of forming mirrors by surface transformation of empty spaces in solid state materials |
Eugene P. Marsh |
2007-08-21 |
$2,251,000 |
| 7242049 |
Memory device |
Leonard Forbes |
2007-07-10 |
$4,773,000 |
| 7196929 |
Method for operating a memory device having an amorphous silicon carbide gate insulator |
Leonard Forbes, Kie Y. Ahn |
2007-03-27 |
$3,220,000 |
| 7169666 |
Method of forming a device having a gate with a selected electron affinity |
Leonard Forbes |
2007-01-30 |
$2,478,000 |
| 7164188 |
Buried conductor patterns formed by surface transformation of empty spaces in solid state materials |
Paul A. Farrar |
2007-01-16 |
$2,988,000 |
| 7164156 |
Electronic systems using optical waveguide interconnects formed throught a semiconductor wafer |
Kie Y. Ahn, Leonard Forbes |
2007-01-16 |
$2,988,000 |
| 7153775 |
Conductive material patterning methods |
Alan R. Reinberg |
2006-12-26 |
$1,821,000 |
| 7154153 |
Memory device |
Leonard Forbes |
2006-12-26 |
$1,821,000 |
| 7142577 |
Method of forming mirrors by surface transformation of empty spaces in solid state materials and structures thereon |
Eugene P. Marsh |
2006-11-28 |
$4,082,000 |
