{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Strained semiconductor by full wafer bonding", "item": "https://www.patentleaderboard.com/patent/7994595"}]}
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Strained semiconductor by full wafer bonding

US Patent 7994595 · Granted Aug 9, 2011

Estimated economic value: $2,316,000 ⓘ

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