Dave Pratt — 21 Patents at Micron

Dave Pratt has been granted 21 US patents while listed as an inventor at Micron. The first was granted in 2004 and the most recent in November 2025. Dave Pratt ranks #201,324 of 4,157,543 US inventors in our database (top 4.8%). Patent records list Dave Pratt in Payson, UT, US.

Patents per Year

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Showing 1–21 of 21 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
12463129	Conductive interconnects and methods of forming conductive interconnects	Raju Ahmed, Frank Speetjens, Darin Miller, Siva Naga Sandeep Chalamalasetty, Yimu Hu +3 more	2025-11-04
12438083	Assemblies having conductive interconnects which are laterally and vertically offset relative to one another	Raju Ahmed, Radhakrishna Kotti, David A. Kewley	2025-10-07
12014983	Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one another	Raju Ahmed, Radhakrishna Kotti, David A. Kewley	2024-06-18	$38,359,000
11978527	Conductive interconnects and methods of forming conductive interconnects	Raju Ahmed, David A. Kewley, Yung-Ta Sung, Frank Speetjens, Gurpreet Lugani	2024-05-07	$32,619,000
11545391	Conductive interconnects and methods of forming conductive interconnects	Raju Ahmed, Frank Speetjens, Darin Miller, Siva Naga Sandeep Chalamalasetty, Yi Hu +3 more	2023-01-03	$12,293,000
11482492	Assemblies having conductive interconnects which are laterally and vertically offset relative to one another	Raju Ahmed, Radhakrishna Kotti, David A. Kewley	2022-10-25	$11,361,000
11328749	Conductive interconnects and methods of forming conductive interconnects	Raju Ahmed, David A. Kewley, Yung-Ta Sung, Frank Speetjens, Gurpreet Lugani	2022-05-10	$22,602,000
10685882	Methods of forming through substrate interconnects	Andy Perkins	2020-06-16	$26,854,000
9828069	Mooring system	Cameron Johnstone	2017-11-28
9685375	Methods of forming through substrate interconnects	Andy Perkins	2017-06-20	$35,069,000
9136259	Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking	—	2015-09-15	$8,329,000
8927410	Methods of forming through substrate interconnects	Andy Perkins	2015-01-06	$15,780,000
8629060	Methods of forming through substrate interconnects	Andy Perkins	2014-01-14	$7,948,000
8546919	Die stacking with an annular via having a recessed socket	—	2013-10-01
8531046	Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside	Kyle K. Kirby, Steve Oliver, Mark Hiatt	2013-09-10	$5,150,000
8227343	Die stacking with an annular via having a recessed socket	—	2012-07-24	$3,889,000
8034702	Methods of forming through substrate interconnects	Andy Perkins	2011-10-11	$2,134,000
7955946	Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices	Kyle K. Kirby, Steve Oliver, Mark Hiatt	2011-06-07	$3,124,000
7952171	Die stacking with an annular via having a recessed socket	—	2011-05-31	$3,152,000
7821107	Die stacking with an annular via having a recessed socket	—	2010-10-26	$3,167,000
6718371	XML-based integrated services framework	Dale Lowry, Samuel F. Fletcher, Helaman David Pratt Ferguson, Craig C. Johnson, Junying Fan +4 more	2004-04-06	$67,837,000

Dave Pratt — 21 Patents

Patents per Year

Issued Patents All Time

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