DP

Dave Pratt

Micron: 17 patents #998 of 6,345Top 20%
NO Novell: 1 patents #346 of 701Top 50%
Overall (All Time): #232,814 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
12014983 Assemblies having conductive interconnects which are laterally and vertically offset relative to one another and methods of forming assemblies having conductive interconnects which are laterally and vertically offset relative to one another Raju Ahmed, Radhakrishna Kotti, David A. Kewley 2024-06-18
11978527 Conductive interconnects and methods of forming conductive interconnects Raju Ahmed, David A. Kewley, Yung-Ta Sung, Frank Speetjens, Gurpreet Lugani 2024-05-07
11545391 Conductive interconnects and methods of forming conductive interconnects Raju Ahmed, Frank Speetjens, Darin Miller, Siva Naga Sandeep Chalamalasetty, Yi Hu +3 more 2023-01-03
11482492 Assemblies having conductive interconnects which are laterally and vertically offset relative to one another Raju Ahmed, Radhakrishna Kotti, David A. Kewley 2022-10-25
11328749 Conductive interconnects and methods of forming conductive interconnects Raju Ahmed, David A. Kewley, Yung-Ta Sung, Frank Speetjens, Gurpreet Lugani 2022-05-10
10685882 Methods of forming through substrate interconnects Andy Perkins 2020-06-16
9828069 Mooring system Cameron Johnstone 2017-11-28
9685375 Methods of forming through substrate interconnects Andy Perkins 2017-06-20
9136259 Method of creating alignment/centering guides for small diameter, high density through-wafer via die stacking — 2015-09-15
8927410 Methods of forming through substrate interconnects Andy Perkins 2015-01-06
8629060 Methods of forming through substrate interconnects Andy Perkins 2014-01-14
8546919 Die stacking with an annular via having a recessed socket — 2013-10-01
8531046 Semiconductor substrates comprising through substrate interconnects that are visible on the substrate backside Kyle K. Kirby, Steve Oliver, Mark Hiatt 2013-09-10
8227343 Die stacking with an annular via having a recessed socket — 2012-07-24
8034702 Methods of forming through substrate interconnects Andy Perkins 2011-10-11
7955946 Methods of determining x-y spatial orientation of a semiconductor substrate comprising an integrated circuit, methods of positioning a semiconductor substrate comprising an integrated circuit, methods of processing a semiconductor substrate, and semiconductor devices Kyle K. Kirby, Steve Oliver, Mark Hiatt 2011-06-07
7952171 Die stacking with an annular via having a recessed socket — 2011-05-31
7821107 Die stacking with an annular via having a recessed socket — 2010-10-26
6718371 XML-based integrated services framework Dale Lowry, Samuel F. Fletcher, Helaman David Pratt Ferguson, Craig C. Johnson, Junying Fan +4 more 2004-04-06