Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Assemblies having conductive interconnects which are laterally and vertically offset relative to one another

Assemblies having conductive interconnects which are laterally and vertically offset relative to one another

US Patent 11482492 · Granted Oct 25, 2022

Estimated economic value: $11,361,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Conductive interconnects and methods of forming conductive interconnects2025
Conductive interconnects and methods of forming conductive interconnects2025
Assemblies having conductive interconnects which are laterally and vertically of2025
Assemblies having conductive interconnects which are laterally and vertically of2025
Assemblies having conductive interconnects which are laterally and vertically of2025
Assemblies having conductive interconnects which are laterally and vertically of2025
Microelectronic devices including slot structures, and related electronic system2025
Microelectronic devices including stadium structures2025
Methods for forming conductive vias, and associated devices and systems2025
Methods for forming conductive vias, and associated devices and systems2025
Methods for forming conductive vias, and associated devices and systems2025
Integrated circuitry, array of cross-point memory cells, method used in forming 2025