Issued Patents All Time
Showing 126–150 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7709776 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2010-05-04 |
| 7701039 | Semiconductor devices and in-process semiconductor devices having conductor filled vias | Warren M. Farnworth | 2010-04-20 |
| 7683458 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, William M. Hiatt, David R. Hembree, James M. Wark +6 more | 2010-03-23 |
| 7648900 | Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same | — | 2010-01-19 |
| 7649145 | Compliant spring contact structures | Warren M. Farnworth | 2010-01-19 |
| 7645635 | Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages | Alan G. Wood, Warren M. Farnworth, Salman Akram | 2010-01-12 |
| 7598167 | Method of forming vias in semiconductor substrates without damaging active regions thereof and resulting structures | Charles M. Watkins, Alan G. Wood, Salman Akram, Warren M. Farnworth | 2009-10-06 |
| 7589008 | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods | — | 2009-09-15 |
| 7547850 | Semiconductor device assemblies with compliant spring contact structures | Warren M. Farnworth | 2009-06-16 |
| 7544592 | Method for increasing etch rate during deep silicon dry etch | Swarnal Borthakur | 2009-06-09 |
| 7531453 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Salman Akram, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2009-05-12 |
| 7528491 | Semiconductor components and assemblies including vias of varying lateral dimensions | Warren M. Farnworth | 2009-05-05 |
| 7504615 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2009-03-17 |
| 7498675 | Semiconductor component having plate, stacked dice and conductive vias | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more | 2009-03-03 |
| 7498647 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, William M. Hiatt | 2009-03-03 |
| 7495316 | Methods of forming conductive vias and methods of forming multichip modules including such conductive vias | Warren M. Farnworth | 2009-02-24 |
| 7488899 | Compliant contact pin assembly and card system | Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2009-02-10 |
| 7459393 | Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more | 2008-12-02 |
| 7456639 | Compliant contact structure | Charles M. Watkins | 2008-11-25 |
| 7452743 | Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer level | Steven Oliver, Lu Velicky, William M. Hiatt, David R. Hembree, Mark E. Tuttle +3 more | 2008-11-18 |
| 7449910 | Test system for semiconductor components having conductive spring contacts | Warren M. Farnworth | 2008-11-11 |
| 7429494 | Microelectronic imagers with optical devices having integral reference features and methods for manufacturing such microelectronic imagers | Steven Oliver, James M. Wark | 2008-09-30 |
| 7425499 | Methods for forming interconnects in vias and microelectronic workpieces including such interconnects | Steven Oliver, William M. Hiatt | 2008-09-16 |
| 7419841 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson, James M. Wark +4 more | 2008-09-02 |
| 7413979 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Sidney B. Rigg, Charles M. Watkins, Peter Benson, Salman Akram | 2008-08-19 |