Issued Patents All Time
Showing 151–175 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7410898 | Methods of fabricating interconnects for semiconductor components | Shuang Meng, Garo Derderian | 2008-08-12 |
| 7409762 | Method for fabricating an interconnect for semiconductor components | — | 2008-08-12 |
| 7411304 | Semiconductor interconnect having conductive spring contacts | Warren M. Farnworth | 2008-08-12 |
| 7394267 | Compliant contact pin assembly and card system | Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2008-07-01 |
| 7389581 | Method of forming compliant contact structures | Charles M. Watkins | 2008-06-24 |
| 7391117 | Method for fabricating semiconductor components with conductive spring contacts | Warren M. Farnworth | 2008-06-24 |
| 7385412 | Systems and methods for testing microfeature devices | Salman Akram, William M. Hiatt, Alan G. Wood, Charles M. Watkins | 2008-06-10 |
| 7378342 | Methods for forming vias varying lateral dimensions | Warren M. Farnworth | 2008-05-27 |
| 7364985 | Method for creating electrical pathways for semiconductor device structures using laser machining processes | — | 2008-04-29 |
| 7363694 | Method of testing using compliant contact structures, contactor cards and test system | Charles M. Watkins | 2008-04-29 |
| 7358751 | Contact pin assembly and contactor card | Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2008-04-15 |
| 7355267 | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements | Warren M. Farnworth | 2008-04-08 |
| 7354863 | Methods of selectively removing silicon | Kevin J. Torek | 2008-04-08 |
| 7348671 | Vias having varying diameters and fills for use with a semiconductor device and methods of forming semiconductor device structures including same | — | 2008-03-25 |
| 7332413 | Semiconductor wafers including one or more reinforcement structures and methods of forming the same | — | 2008-02-19 |
| 7329943 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Salman Akram, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2008-02-12 |
| 7314821 | Method for fabricating a semiconductor interconnect having conductive spring contacts | Warren M. Farnworth | 2008-01-01 |
| 7300857 | Through-wafer interconnects for photoimager and memory wafers | Salman Akram, Charles M. Watkins, Mark Hiatt, David R. Hembree, James M. Wark +6 more | 2007-11-27 |
| 7297563 | Method of making contact pin card system | Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-11-20 |
| 7294897 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | Salman Akram, Charles M. Watkins, Alan G. Wood, William M. Hiatt | 2007-11-13 |
| 7288954 | Compliant contact pin test assembly and methods thereof | Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-30 |
| 7287326 | Methods of forming a contact pin assembly | Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-30 |
| 7282784 | Methods of manufacture of a via structure comprising a plurality of conductive elements and methods of forming multichip modules including such via structures | Warren M. Farnworth | 2007-10-16 |
| 7282932 | Compliant contact pin assembly, card system and methods thereof | Warren M. Farnworth, James M. Wark, William M. Hiatt, David R. Hembree, Alan G. Wood | 2007-10-16 |
| 7271482 | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods | — | 2007-09-18 |