Issued Patents All Time
Showing 176–200 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7265330 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-09-04 |
| 7262134 | Microfeature workpieces and methods for forming interconnects in microfeature workpieces | William M. Hiatt, Richard L. Stocks | 2007-08-28 |
| 7253397 | Packaged microelectronic imagers and methods of packaging microelectronic imagers | — | 2007-08-07 |
| 7244663 | Wafer reinforcement structure and methods of fabrication | — | 2007-07-17 |
| 7232754 | Microelectronic devices and methods for forming interconnects in microelectronic devices | Salman Akram, David R. Hembree, Sidney B. Rigg, Warren M. Farnworth, William M. Hiatt | 2007-06-19 |
| 7224051 | Semiconductor component having plate and stacked dice | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more | 2007-05-29 |
| 7199439 | Microelectronic imagers and methods of packaging microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Peter Benson, James M. Wark +4 more | 2007-04-03 |
| 7189954 | Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers | Warren M. Farnworth, Sidney B. Rigg, William M. Hiatt, Alan G. Wood, Peter Benson +4 more | 2007-03-13 |
| 7189642 | Methods of fabricating interconnects including depositing a first material in the interconnect with a thickness of angstroms and a low temperature for semiconductor components | Shuang Meng, Garo Derderian | 2007-03-13 |
| 7169248 | Methods for releasably attaching support members to microfeature workpieces and microfeature assemblies formed using such methods | Steven Oliver | 2007-01-30 |
| 7148715 | Systems and methods for testing microelectronic imagers and microfeature devices | Salman Akram, William M. Hiatt, Alan G. Wood, Charles M. Watkins | 2006-12-12 |
| 7129567 | Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements | Warren M. Farnworth | 2006-10-31 |
| 7109068 | Through-substrate interconnect fabrication methods | Salman Akram | 2006-09-19 |
| 7101792 | Methods of plating via interconnects | Warren M. Farnworth | 2006-09-05 |
| 7091124 | Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices | Sidney B. Rigg, Charles M. Watkins, Peter Benson, Salman Akram | 2006-08-15 |
| 7078922 | Semiconductor interconnect having semiconductor spring contacts | — | 2006-07-18 |
| 7071098 | Methods of fabricating interconnects for semiconductor components including a through hole entirely through the component and forming a metal nitride including separate precursor cycles | Shuang Meng, Garo Derderian | 2006-07-04 |
| 7064010 | Methods of coating and singulating wafers | Warren M. Farnworth, William M. Hiatt | 2006-06-20 |
| 7060526 | Wafer level methods for fabricating multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more | 2006-06-13 |
| 7053641 | Interconnect having spring contacts | — | 2006-05-30 |
| 7042080 | Semiconductor interconnect having compliant conductive contacts | Warren M. Farnworth | 2006-05-09 |
| 7030632 | Compliant contract structures, contactor cards and test system including same | Charles M. Watkins | 2006-04-18 |
| 6998345 | Methods of forming via plugs using an aerosol stream of particles to deposit conductive material | — | 2006-02-14 |
| 6998717 | Multi-dice chip scale semiconductor components | Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more | 2006-02-14 |
| 6982565 | Test system and test method with interconnect having semiconductor spring contacts | — | 2006-01-03 |