Issued Patents All Time
Showing 51–75 of 210 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10529592 | Semiconductor device assembly with pillar array | Owen R. Fay, Akshay N. Singh | 2020-01-07 |
| 10483221 | 3DI solder cup | — | 2019-11-19 |
| 10446486 | Multi-die inductors with coupled through-substrate via cores | — | 2019-10-15 |
| 10424553 | Semiconductor devices with underfill control features, and associated systems and methods | Suresh Yeruva, Owen R. Fay, Sameer S. Vadhavkar | 2019-09-24 |
| 10157830 | 3D interconnect multi-die inductors with through-substrate via cores | — | 2018-12-18 |
| 10134671 | 3D interconnect multi-die inductors with through-substrate via cores | — | 2018-11-20 |
| 10134647 | Methods for forming interconnect assemblies with probed bond pads | Owen R. Fay, Luke England, Jaspreet S. Gandhi | 2018-11-20 |
| 10121739 | Multi-die inductors with coupled through-substrate via cores | — | 2018-11-06 |
| 10020287 | Pass-through interconnect structure for microelectronic dies and associated systems and methods | David S. Pratt, Dewali Ray | 2018-07-10 |
| 9966406 | Semiconductor devices including back-side integrated circuitry | Steve Oliver | 2018-05-08 |
| 9935085 | Semiconductor substrates with unitary vias and via terminals, and associated systems and methods | Kunal R. Parekh | 2018-04-03 |
| 9917002 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2018-03-13 |
| 9799562 | Vias and conductive routing layers in semiconductor substrates | Sarah A. Niroumand | 2017-10-24 |
| 9653420 | Microelectronic devices and methods for filling vias in microelectronic devices | William M. Hiatt | 2017-05-16 |
| 9646899 | Interconnect assemblies with probed bond pads | Owen R. Fay, Luke England, Jaspreet S. Gandhi | 2017-05-09 |
| 9627295 | Devices, systems and methods for manufacturing through-substrate vias and front-side structures | Anurag Jindal, Jian He, Lalapet Rangan Vasudevan, Hongqi Li | 2017-04-18 |
| 9607930 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, William M. Hiatt | 2017-03-28 |
| 9514975 | Semiconductor with through-substrate interconnect | Kunal R. Parekh | 2016-12-06 |
| 9508628 | Semiconductor substrates with unitary vias and via terminals, and associated systems and methods | Kunal R. Parekh | 2016-11-29 |
| 9484378 | Semiconductor devices including back-side integrated circuitry | Steve Oliver | 2016-11-01 |
| 9449906 | Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs | Kunal R. Parekh | 2016-09-20 |
| 9343368 | Disabling electrical connections using pass-through 3D interconnects and associated systems and methods | Jeffery W. Janzen, Michael Chaine, William M. Hiatt | 2016-05-17 |
| 9343362 | Microelectronic devices with through-silicon vias and associated methods of manufacturing | Kunal R. Parekh, Philip J. Ireland, Sarah A. Niroumand | 2016-05-17 |
| 9305865 | Devices, systems and methods for manufacturing through-substrate vias and front-side structures | Anurag Jindal, Jian He, Lalapet Rangan Vasudevan, Hongqi Li | 2016-04-05 |
| 9214391 | Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods | — | 2015-12-15 |