Issued Patents All Time
Showing 25 most recent of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12363915 | On-pitch vias for semiconductor devices and associated devices and systems | James A. Cultra | 2025-07-15 |
| 12237217 | Methods of exposing conductive Vias of semiconductor devices and related semiconductor devices | Anurag Jindal, Irina Vasilyeva | 2025-02-25 |
| 12144188 | Multitier arrangements of integrated devices, and methods of forming sense/access lines | Lei Wei | 2024-11-12 |
| 11770928 | Devices including floating vias | James A. Cultra, Sri Sai Sivakumar Vegunta | 2023-09-26 |
| 11764147 | Slit oxide and via formation techniques | Kaushik Varma Sagi, Manzar Siddik | 2023-09-19 |
| 11600666 | Multitier arrangements of integrated devices, and methods of forming sense/access lines | Lei Wei | 2023-03-07 |
| 11545623 | Fabrication of electrodes for memory cells | Pengyuan Zheng, Yongjun Jeff Hu, Yao Jin, Andrea Gotti | 2023-01-03 |
| 11437435 | On-pitch vias for semiconductor devices and associated devices and systems | James A. Cultra | 2022-09-06 |
| 11367681 | Slit oxide and via formation techniques | Kaushik Varma Sagi, Manzar Siddik | 2022-06-21 |
| 11355508 | Devices including floating vias and related systems and methods | James A. Cultra, Sri Sai Sivakumar Vegunta | 2022-06-07 |
| 11203239 | Traction device and traction method | Shangmin Sun, Yuan He, Quanwei Song, Qiangqiang Wang, Weifeng Yu | 2021-12-21 |
| 11104309 | Fork-arm lift tractor | Yuan He, Jianmin Li, Yulan Li, Qiangqiang Wang, Yuanjing Li +2 more | 2021-08-31 |
| 11011420 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Anurag Jindal, Jin Lu, Shyam Ramalingam | 2021-05-18 |
| 10957741 | Multitier arrangements of integrated devices, and methods of forming sense/access lines | Lei Wei | 2021-03-23 |
| 10847442 | Interconnect assemblies with through-silicon vias and stress-relief features | Anurag Jindal, Jin Lu, Gowrisankar Damarla, Shyam Ramalingam | 2020-11-24 |
| 10825987 | Fabrication of electrodes for memory cells | Pengyuan Zheng, Yongjun Jeff Hu, Yao Jin, Andrea Gotti | 2020-11-03 |
| 10546777 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Anurag Jindal, Jin Lu, Shyam Ramalingam | 2020-01-28 |
| 10543579 | Polishing apparatuses and polishing methods | Jian Zhou, James A. Cultra | 2020-01-28 |
| 10389276 | Integral preload mechanism for piezoelectric actuator | — | 2019-08-20 |
| 10319678 | Capping poly channel pillars in stacked circuits | Gowrisankar Damarla, Roger W. Lindsay, Zailong Bian, Jin Lu, Shyam Ramalingam +1 more | 2019-06-11 |
| 10286517 | Polishing apparatuses | Jian Zhou, James A. Cultra | 2019-05-14 |
| 10197510 | Vehicle traction system and radiation imaging check system | Qiangqiang Wang, Quanwei Song, Yuan He, Junping Shi, Yucheng Dong +2 more | 2019-02-05 |
| 10161560 | Integrated picomotor mount | — | 2018-12-25 |
| 9922875 | Conductive interconnect structures incorporating negative thermal expansion materials and associated systems, devices, and methods | Anurag Jindal, Jin Lu, Shyam Ramalingam | 2018-03-20 |
| 9911653 | Low capacitance interconnect structures and associated systems and methods | Jin Lu, Kevin J. Torek, Thy Tran, Alex J. Schrinsky | 2018-03-06 |