Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368131 | Embedded nanoparticles for on-die thermal enhancement of hybrid bonding and associated systems and methods | Bang-Ning Hsu, Kyle K. Kirby | 2025-07-22 |
| 12334469 | Piezoelectric materials for on-die thermal enhancement of hybrid bonding and associated systems and methods | Kyle K. Kirby | 2025-06-17 |
| 12191164 | Hybrid mold chase surface for semiconductor bonding and related systems and methods | — | 2025-01-07 |
| 7844989 | Method and broadcasting receiver for displaying the receiving status of broadcasting program information | — | 2010-11-30 |
| 6225379 | Epoxy resin composition for bonding semiconductor chips | Jae Sung Kwak | 2001-05-01 |