Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7564122 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more | 2009-07-21 |
| 7322507 | Transducer assembly, capillary and wire bonding method using the same | Song Hak Kim | 2008-01-29 |
| 7057280 | Leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more | 2006-06-06 |
| 6825062 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more | 2004-11-30 |
| 6448633 | Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant | Jae Hak Yee, Young Suk Chung, Jae Jin Lee, Terry Davis, Chung Suk Han +2 more | 2002-09-10 |
| 6225379 | Epoxy resin composition for bonding semiconductor chips | Byung Hoon Moon | 2001-05-01 |