Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10066299 | Plating catalyst and method | Suk Kwan Kwong, Weijuan ZHOU, Wenjia Zhou, Dennis Chit Yiu Chan | 2018-09-04 |
| 9809883 | Formaldehyde free electroless copper plating compositions and methods | Andy Lok-Fung Chow, Crystal P. L. Li | 2017-11-07 |
| 9783890 | Process for electroless plating and a solution used for the same | Michael Chi-Yung Tang, Martin W. Bayes, Ka Ming Yip, Chun-Man Chan, Hung Tat Chan +2 more | 2017-10-10 |
| 9611550 | Formaldehyde free electroless copper plating compositions and methods | Andy Lok-Fung Chow, Crystal P. L. Li | 2017-04-04 |
| 9499910 | Process for electroless plating and a solution used for the same | Michael Chi-Yung Tang, Martin W. Bayes, Ka Ming Yip, Chun-Man Chan, Hung Tat Chan +2 more | 2016-11-22 |
| 9227182 | Plating catalyst and method | Wenjia Zhou, Suk Kwan Kwong, Dennis Chit Yiu Chan, Weijuan ZHOU | 2016-01-05 |
| 9149798 | Plating catalyst and method | Wenjia Zhou, Suk Kwan Kwong, Dennis Chit Yiu Chan | 2015-10-06 |