Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12398480 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Vincent Paneccasio, Jr., Thomas B. Richardson, Ivan Li | 2025-08-26 |
| 12270121 | Composition and method for fabrication of nickel interconnects | Eric Yakobson, Shaopeng Sun, Elie H. Najjar, Thomas B. Richardson, Vincent Paneccasio, Jr. +1 more | 2025-04-08 |
| 11873568 | Compositions and methods for the electrodeposition of nanotwinned copper | Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar | 2024-01-16 |
| 11807951 | Cobalt chemistry for smooth topology | Shaopeng Sun, Stephan I. Braye, Elie H. Najjar | 2023-11-07 |
| 11697884 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise | 2023-07-11 |
| 11434578 | Cobalt filling of interconnects in microelectronics | John Commander, Vincent Paneccasio, Jr., Eric Rouya, Shaopeng Sun, Jianwen Han | 2022-09-06 |
| 11401618 | Cobalt filling of interconnects | John Commander, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2022-08-02 |
| 11384446 | Compositions and methods for the electrodeposition of nanotwinned copper | Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar | 2022-07-12 |
| 11230778 | Cobalt chemistry for smooth topology | Shaopeng Sun, Stephan I. Braye, Elie H. Najjar | 2022-01-25 |
| 11168406 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Vincent Paneccasio, Jr., Thomas B. Richardson, Ivan Li | 2021-11-09 |
| 11124888 | Copper deposition in wafer level packaging of integrated circuits | Thomas B. Richardson, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise | 2021-09-21 |
| 11035048 | Cobalt filling of interconnects | John Commander, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more | 2021-06-15 |
| 10995417 | Cobalt filling of interconnects in microelectronics | John Commander, Vincent Paneccasio, Jr., Eric Rouya, Shaopeng Sun, Jianwen Han | 2021-05-04 |
| 10519557 | Leveler compositions for use in copper deposition in manufacture of microelectronics | Vincent Paneccasio, Jr., Thomas B. Richardson, Ivan Li | 2019-12-31 |
| 10294574 | Levelers for copper deposition in microelectronics | Vincent Paneccasio, Jr., Thomas B. Richardson, Eric Rouya | 2019-05-21 |