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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Macdermid Enthone › Kyle Whitten
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Kyle Whitten — 15 Patents

MEMacdermid Enthone: 15 patents #1 of 53Top 2%
Waterbury, CT: #21 of 331 inventorsTop 7%
Connecticut: #2,943 of 34,797 inventorsTop 9%
Overall (All Time): #307,048 of 4,157,543Top 8%
15 Patents All Time
Kyle Whitten has been granted 15 US patents while listed as an inventor at Macdermid Enthone. The first was granted in 2019 and the most recent in August 2025. Kyle Whitten ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Kyle Whitten in Waterbury, CT, US.

Patents per Year

Patents granted per year, 2019 to 2025Bar chart with a peak of 4 patents in 2021.peak 42019: 2 patents20192021: 4 patents20212022: 4 patents20222023: 2 patents20232024: 1 patents20242025: 2 patents2025

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDate
12398480 Leveler compositions for use in copper deposition in manufacture of microelectronics Vincent Paneccasio, Jr., Thomas B. Richardson, Ivan Li 2025-08-26
12270121 Composition and method for fabrication of nickel interconnects Eric Yakobson, Shaopeng Sun, Elie H. Najjar, Thomas B. Richardson, Vincent Paneccasio, Jr. +1 more 2025-04-08
11873568 Compositions and methods for the electrodeposition of nanotwinned copper Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar 2024-01-16
11807951 Cobalt chemistry for smooth topology Shaopeng Sun, Stephan I. Braye, Elie H. Najjar 2023-11-07
11697884 Copper deposition in wafer level packaging of integrated circuits Thomas B. Richardson, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise 2023-07-11
11434578 Cobalt filling of interconnects in microelectronics John Commander, Vincent Paneccasio, Jr., Eric Rouya, Shaopeng Sun, Jianwen Han 2022-09-06
11401618 Cobalt filling of interconnects John Commander, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more 2022-08-02
11384446 Compositions and methods for the electrodeposition of nanotwinned copper Stephan I. Braye, Jianwen Han, Pingping Ye, Thomas B. Richardson, Elie H. Najjar 2022-07-12
11230778 Cobalt chemistry for smooth topology Shaopeng Sun, Stephan I. Braye, Elie H. Najjar 2022-01-25
11168406 Leveler compositions for use in copper deposition in manufacture of microelectronics Vincent Paneccasio, Jr., Thomas B. Richardson, Ivan Li 2021-11-09
11124888 Copper deposition in wafer level packaging of integrated circuits Thomas B. Richardson, Vincent Paneccasio, Jr., John Commander, Richard Hurtubise 2021-09-21
11035048 Cobalt filling of interconnects John Commander, Vincent Paneccasio, Jr., Shaopeng Sun, Eric Yakobson, Jianwen Han +1 more 2021-06-15
10995417 Cobalt filling of interconnects in microelectronics John Commander, Vincent Paneccasio, Jr., Eric Rouya, Shaopeng Sun, Jianwen Han 2021-05-04
10519557 Leveler compositions for use in copper deposition in manufacture of microelectronics Vincent Paneccasio, Jr., Thomas B. Richardson, Ivan Li 2019-12-31
10294574 Levelers for copper deposition in microelectronics Vincent Paneccasio, Jr., Thomas B. Richardson, Eric Rouya 2019-05-21

Frequent Collaborators

Vincent Paneccasio, Jr.11 shared
Thomas B. Richardson9 shared
Shaopeng Sun7 shared
Elie H. Najjar7 shared
Jianwen Han6 shared
John Commander6 shared

Nearby-Ranked Inventors

Naoya Kasahara15
Aaron Larry Snyder15
Avishay Meron15
Stuart Hatfield15
Satoshi KUNIYASU15
Ashton Mason15
Theodore Yuchiang Cheng15
Richard Sharbaugh15
Rajen Bhatt15