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Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
SS

Shaopeng Sun — 9 Patents

MEMacdermid Enthone: 9 patents #4 of 53Top 8%
Orange, CT: #40 of 246 inventorsTop 20%
Connecticut: #5,094 of 34,797 inventorsTop 15%
Overall (All Time): #535,341 of 4,157,543Top 15%
9 Patents All Time
Shaopeng Sun has been granted 9 US patents while listed as an inventor at Macdermid Enthone. The first was granted in 2021 and the most recent in April 2025. Shaopeng Sun ranks #535,341 of 4,157,543 US inventors in our database (top 12.9%). Patent records list Shaopeng Sun in Orange, CT, US.

Patents per Year

Patents granted per year, 2021 to 2025Bar chart with a peak of 3 patents in 2022.peak 32021: 2 patents20212022: 3 patents20222023: 2 patents20232024: 1 patents20242025: 1 patents2025

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12270121 Composition and method for fabrication of nickel interconnects Eric Yakobson, Elie H. Najjar, Thomas B. Richardson, Vincent Paneccasio, Jr., Wenbo Shao +1 more 2025-04-08
12157944 Method and wet chemical compositions for diffusion barrier formation Richard Hurtubise, Eric Yakobson, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao 2024-12-03
11846018 Method and wet chemical compositions for diffusion barrier formation Richard Hurtubise, Eric Yakobson, Taylor L. Wilkins, Elie H. Najjar, Wenbo Shao 2023-12-19
11807951 Cobalt chemistry for smooth topology Kyle Whitten, Stephan I. Braye, Elie H. Najjar 2023-11-07
11434578 Cobalt filling of interconnects in microelectronics John Commander, Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Jianwen Han 2022-09-06
11401618 Cobalt filling of interconnects John Commander, Kyle Whitten, Vincent Paneccasio, Jr., Eric Yakobson, Jianwen Han +1 more 2022-08-02
11230778 Cobalt chemistry for smooth topology Kyle Whitten, Stephan I. Braye, Elie H. Najjar 2022-01-25
11035048 Cobalt filling of interconnects John Commander, Kyle Whitten, Vincent Paneccasio, Jr., Eric Yakobson, Jianwen Han +1 more 2021-06-15
10995417 Cobalt filling of interconnects in microelectronics John Commander, Vincent Paneccasio, Jr., Eric Rouya, Kyle Whitten, Jianwen Han 2021-05-04