Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7303992 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Xuan Lin, Paul Figura | 2007-12-04 |
| 7268074 | Capping of metal interconnects in integrated circuit electronic devices | Eric Yakobson, Christian Witt, Qingyun Chen | 2007-09-11 |
| 6776893 | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect | Elena H. Too, Paul R. Gerst, Vincent Paneccasio, Jr. | 2004-08-17 |
| 6024856 | Copper metallization of silicon wafers using insoluble anodes | Juan Haydu, Elena H. Too | 2000-02-15 |