Issued Patents All Time
Showing 26–50 of 124 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10283608 | Low resistance contacts to source or drain region of transistor | Frank W. Mont, Mark V. Raymond, Chengyu Niu | 2019-05-07 |
| 10276689 | Method of forming a vertical field effect transistor (VFET) and a VFET structure | Yi Qi, Jianwei Peng, Hsien-Ching Lo, Ruilong Xie, Hui Zang | 2019-04-30 |
| 10262892 | Skip via structures | Frank W. Mont, Errol Todd Ryan | 2019-04-16 |
| 10236256 | Pre-spacer self-aligned cut formation | Shao Beng Law | 2019-03-19 |
| 10211147 | Metal-insulator-metal capacitors with dielectric inner spacers | Chanro Park, Lei Sun, Yi Qi, Roderick A. Augur | 2019-02-19 |
| 10199261 | Via and skip via structures | James Jay McMahon, Ryan Smith, Nicholas V. LiCausi, Errol Todd Ryan, Shao Beng Law | 2019-02-05 |
| 10199271 | Self-aligned metal wire on contact structure and method for forming same | Ruilong Xie, Guillaume Bouche, Laertis Economikos, Lei Sun, Guoxiang Ning | 2019-02-05 |
| 10199264 | Self aligned interconnect structures | Roderick A. Augur, Hoon Kim | 2019-02-05 |
| 10164104 | Method to form air-gap spacers and air-gap spacer-containing structures | Ruilong Xie | 2018-12-25 |
| 10163633 | Non-mandrel cut formation | Shao Beng Law, Errol Todd Ryan, Nicholas V. LiCausi | 2018-12-25 |
| 10157833 | Via and skip via structures | Dongfei Pei, Frank W. Mont | 2018-12-18 |
| 10109526 | Etch profile control during skip via formation | Nicholas V. LiCausi, J. Jay McMahon, Ryan Smith, Errol Todd Ryan, Shao Beng Law | 2018-10-23 |
| 10109490 | Cobalt interconnects formed by selective bottom-up fill | Sean Xuan Lin | 2018-10-23 |
| 10079208 | IC structure with interface liner and methods of forming same | Moosung Chae | 2018-09-18 |
| 10056292 | Self-aligned lithographic patterning | Shao Beng Law, Genevieve Beique, Frank W. Mont, Lei Sun | 2018-08-21 |
| 10056291 | Post spacer self-aligned cuts | Shao Beng Law, Frank W. Mont, Genevieve Beique, Lei Sun | 2018-08-21 |
| 10026687 | Metal interconnects for super (skip) via integration | Sean Xuan Lin, Shao Beng Law, James Jay McMahon | 2018-07-17 |
| 10014297 | Methods of forming integrated circuit structure using extreme ultraviolet photolithography technique and related integrated circuit structure | Lei Sun, Wenhui Wang, Ruilong Xie, Jia Zeng, Xuelian Zhu +2 more | 2018-07-03 |
| 10014215 | Method and apparatus for placing a gate contact inside a semiconductor active region having high-k dielectric gate caps | Andre P. Labonte, Ruilong Xie | 2018-07-03 |
| 9984919 | Inverted damascene interconnect structures | Chanro Park, Yongan Xu, Peng Xu, Yann Mignot | 2018-05-29 |
| 9966338 | Pre-spacer self-aligned cut formation | Shao Beng Law | 2018-05-08 |
| 9953834 | Method of making self-aligned continuity cuts in mandrel and non-mandrel metal lines | Lei Sun, Ruilong Xie, Ryan Ryoung-Han Kim | 2018-04-24 |
| 9941278 | Method and apparatus for placing a gate contact inside an active region of a semiconductor | Andre P. Labonte, Ruilong Xie | 2018-04-10 |
| 9922929 | Self aligned interconnect structures | Roderick A. Augur, Hoon Kim | 2018-03-20 |
| 9911604 | Sidewall spacer pattern formation method | Lei Sun, Ruilong Xie, Yulu Chen | 2018-03-06 |