Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11737373 | Silicide passivation of niobium | Matthew W. Copel, James B. Hannon | 2023-08-22 |
| 11221310 | Reproducible and manufacturable nanogaps for embedded transverse electrode pairs in nanochannels | Joshua T. Smith, Benjamin H. Wunsch | 2022-01-11 |
| 10600656 | Directed self-assembly for copper patterning | Eric A. Joseph, Hiroyuki Miyazoe, HsinYu Tsai | 2020-03-24 |
| 10505112 | CMOS compatible non-filamentary resistive memory stack | Takashi Ando, Eduard A. Cartier, John Bruley | 2019-12-10 |
| 10332957 | Stacked capacitor with symmetric leakage and break-down behaviors | Takashi Ando, Eduard A. Cartier, Vijay Narayanan | 2019-06-25 |
| 10168299 | Reproducible and manufacturable nanogaps for embedded transverse electrode pairs in nanochannels | Joshua T. Smith, Benjamin H. Wunsch | 2019-01-01 |
| 10068850 | Trench silicide with self-aligned contact vias | Josephine B. Chang, Michael A. Guillorn, Fei Liu | 2018-09-04 |
| 10014214 | Electronic device including moat power metallization in trench | Josephine B. Chang, Leland Chang, Michael A. Guillorn, Chung-Hsun Lin | 2018-07-03 |
| 9721888 | Trench silicide with self-aligned contact vias | Josephine B. Chang, Michael A. Guillorn, Fei Liu | 2017-08-01 |
| 9716036 | Electronic device including moat power metallization in trench | Josephine B. Chang, Leland Chang, Michael A. Guillorn, Chung-Hsun Lin | 2017-07-25 |
| 9653679 | Magnetoresistive structures with stressed layer | Anthony J. Annunziata, Chandrasekharan Kothandaraman, Gen P. Lauer | 2017-05-16 |
| 9601686 | Magnetoresistive structures with stressed layer | Anthony J. Annunziata, Chandrasekharan Kothandaraman, Gen P. Lauer | 2017-03-21 |
| 9437443 | Low-temperature sidewall image transfer process using ALD metals, metal oxides and metal nitrides | Markus Brink, Michael A. Guillorn, Sebastian U. Engelmann, Hiroyuki Miyazoe, Jeffrey W. Sleight | 2016-09-06 |
| 9349640 | Electrode pair fabrication using directed self assembly of diblock copolymers | Josephine B. Chang, Michael A. Guillorn, Hiroyuki Miyazoe, HsinYu Tsai | 2016-05-24 |
| 9306164 | Electrode pair fabrication using directed self assembly of diblock copolymers | Josephine B. Chang, Michael A. Guillorn, Hiroyuki Miyazoe, HsinYu Tsai | 2016-04-05 |
| 9018090 | Borderless self-aligned metal contact patterning using printable dielectric materials | Josephine B. Chang, Sebastian U. Engelmann, Nicholas C. M. Fuller, Michael A. Guillorn, Eric A. Joseph | 2015-04-28 |