Issued Patents All Time
Showing 51–75 of 120 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7888252 | Self-aligned contact | Johnathan E. Faltermeier, Stephan Grunow, Kangguo Cheng, Kaushik A. Kumar, Lawrence A. Clevenger +2 more | 2011-02-15 |
| 7855137 | Method of making a sidewall-protected metallic pillar on a semiconductor substrate | Mukta G. Farooq, Waldemar Walter Kocon, Richard P. Volant | 2010-12-21 |
| 7851919 | Metal interconnect and IC chip including metal interconnect | Karl W. Barth, Ramona Kei, Kaushik A. Kumar, Shahab Siddiqui | 2010-12-14 |
| 7833893 | Method for forming conductive structures | Stephan Grunow, Kaushik A. Kumar, Richard P. Volant | 2010-11-16 |
| 7829427 | Method of fabricating a high Q factor integrated circuit inductor | Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, John Harold Magerlein +2 more | 2010-11-09 |
| 7825019 | Structures and methods for reduction of parasitic capacitances in semiconductor integrated circuits | Lawrence A. Clevenger, Stephan Grunow, Kaushik A. Kumar, Vidhya Ramachandran | 2010-11-02 |
| 7816248 | Solder connector structure and method | Mukta G. Farooq, Lacrtis Economikos, Ian D. Melville, Richard P. Volant | 2010-10-19 |
| 7718525 | Metal interconnect forming methods and IC chip including metal interconnect | Karl W. Barth, Ramona Kei, Kaushik A. Kumar, Shahab Siddiqui | 2010-05-18 |
| 7696631 | Wire bonding personalization and discrete component attachment on wirebond pads | Frederic Beaulieu, Mukta G. Farooq | 2010-04-13 |
| 7638406 | Method of fabricating a high Q factor integrated circuit inductor | Daniel C. Edelstein, Panayotis Andricacos, John M. Cotte, Hariklia Deligianni, John Harold Magerlein +2 more | 2009-12-29 |
| 7635643 | Method for forming C4 connections on integrated circuit chips and the resulting devices | Timothy H. Daubenspeck, Mukta G. Farooq, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter | 2009-12-22 |
| 7629264 | Structure and method for hybrid tungsten copper metal contact | Griselda Bonilla, Kaushik A. Kumar, Lawrence A. Clevenger, Stephan Grunow, Roger A. Quon | 2009-12-08 |
| 7572726 | Method of forming a bond pad on an I/C chip and resulting structure | Julie C. Biggs, Tien-Jen Cheng, David E. Eichstadt, Lisa A. Fanti, Jonathan H. Griffith +6 more | 2009-08-11 |
| 7541277 | Stress relaxation, selective nitride phase removal | John Charles Petrus, Karl W. Barth, Kaushik A. Kumar | 2009-06-02 |
| 7534651 | Seedless wirebond pad plating | Chandrasekhar Narayan | 2009-05-19 |
| 7534696 | Multilayer interconnect structure containing air gaps and method for making | Christopher V. Jahnes, Satyanarayana V. Nitta, Katherine L. Saenger | 2009-05-19 |
| 7531444 | Method to create air gaps using non-plasma processes to damage ILD materials | Christos D. Dimitrakopoulos, Daniel C. Edelstein, Vincent J. McGahay, Satyanarayana V. Nittta, Shom Ponoth +1 more | 2009-05-12 |
| 7528048 | Planar vertical resistor and bond pad resistor and related method | Douglas D. Coolbaugh, Timothy J. Dalton, Daniel C. Edelstein, Ebenezer E. Eshun, Jeffrey P. Gambino +2 more | 2009-05-05 |
| 7485964 | Dielectric material | John M. Cotte, Kenneth McCullough, Wayne M. Moreau, John P. Simons, Charles J. Taft +1 more | 2009-02-03 |
| 7470985 | Solder connector structure and method | Mukta G. Farooq, Laertis Economikos, Ian D. Melville, Richard P. Volant | 2008-12-30 |
| 7468124 | Method and apparatus for copper corrosion prevention during wet clean | Nancy Anne Greco, Kimberly F. Hooper | 2008-12-23 |
| 7456099 | Method of forming a structure for reducing lateral fringe capacitance in semiconductor devices | Lawrence A. Clevenger, Stephan Grunow, Kaushik A. Kumar, Vidhya Ramachandran, Theodorus E. Standaert | 2008-11-25 |
| 7394110 | Planar vertical resistor and bond pad resistor | Douglas D. Coolbaugh, Timothy J. Dalton, Daniel C. Edelstein, Ebenezer E. Eshun, Jeffrey P. Gambino +2 more | 2008-07-01 |
| 7355271 | Flexible assembly of stacked chips | Richard P. Volant, George F. Walker | 2008-04-08 |
| 7279426 | Like integrated circuit devices with different depth | Habib Hichri, Kimberly Larsen, Helen L. Maynard | 2007-10-09 |